Issued Patents 2018
Showing 26–50 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090284 | Semiconductor device and method of manufacture | Wei-Yu Chen, Tien-Chung Yang, An-Jhih Su | 2018-10-02 |
| 10090241 | Device, package structure and method of forming the same | An-Jhih Su, Li-Hsien Huang | 2018-10-02 |
| 10083927 | Chip package structure with bump | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2018-09-25 |
| 10079213 | Packaging devices and methods of manufacture thereof | Tsung-Yuan Yu, Ming-Da Cheng, Wen-Hsiung Lu | 2018-09-18 |
| 10074618 | Semiconductor structure and manufacturing method thereof | Ying-Ju Chen, Ming-Fa Chen | 2018-09-11 |
| 10074631 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, An-Jhih Su | 2018-09-11 |
| 10074584 | Method of forming a semiconductor component comprising a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer | Ying-Ju Chen | 2018-09-11 |
| 10068844 | Integrated fan-out structure and method of forming | Ming-Yen Chiu | 2018-09-04 |
| 10068887 | Semiconductor packages and methods of forming the same | Jie Chen | 2018-09-04 |
| 10068873 | Method and apparatus for connecting packages onto printed circuit boards | — | 2018-09-04 |
| 10062648 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2018-08-28 |
| 10056347 | Bump structure for yield improvement | Tzu-Wei Chiu, Tzu-Yu Wang, Shang-Yun Hou, Shin-Puu Jeng, Hung-An Teng +1 more | 2018-08-21 |
| 10056312 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2018-08-21 |
| 10049898 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu, Chien-Fu Tseng | 2018-08-14 |
| 10043770 | System and method for an improved interconnect structure | Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu, Tsung-Yuan Yu | 2018-08-07 |
| 10037953 | Contact pad for semiconductor devices | Jie Chen, Ying-Ju Chen | 2018-07-31 |
| 10037955 | Packaging devices and methods of manufacture thereof | Jie Chen | 2018-07-31 |
| 10037962 | Ball height control in bonding process | Tsung-Yuan Yu, Jie Chen | 2018-07-31 |
| 10037963 | Package structure and method of forming the same | Jie Chen, Chen-Hua Yu, Der-Chyang Yeh | 2018-07-31 |
| 10032746 | Semiconductor device having recessed edges and method of manufacture | — | 2018-07-24 |
| 10032712 | Semiconductor structure | Ying-Ju Chen | 2018-07-24 |
| 10032704 | Reducing cracking by adjusting opening size in pop packages | — | 2018-07-24 |
| 10032651 | Package structures and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Lai Wei Chih | 2018-07-24 |
| 10026646 | Packages with through-vias having tapered ends | — | 2018-07-17 |
| 10026704 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Jie Chen | 2018-07-17 |