Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056347 | Bump structure for yield improvement | Tzu-Wei Chiu, Tzu-Yu Wang, Shang-Yun Hou, Shin-Puu Jeng, Hsien-Wei Chen +1 more | 2018-08-21 |
HT
Hung-An Teng
Overall (2018): #392,719 of 503,207Top 80%
1
Patents 2018