Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163770 | Fan-out package structure and method | Sao-Ling Chiu | 2018-12-25 |
| 10056347 | Bump structure for yield improvement | Tzu-Yu Wang, Shang-Yun Hou, Shin-Puu Jeng, Hsien-Wei Chen, Hung-An Teng +1 more | 2018-08-21 |
| 9953911 | Fan-out package structure and method | Sao-Ling Chiu | 2018-04-24 |