Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163770 | Fan-out package structure and method | Tzu-Wei Chiu | 2018-12-25 |
| 9984981 | Packages with interposers and methods for forming the same | Kuo-Ching Hsu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2018-05-29 |
| 9953911 | Fan-out package structure and method | Tzu-Wei Chiu | 2018-04-24 |