Issued Patents 2018
Showing 76–88 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9929069 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, An-Jhih Su, Li-Hsien Huang | 2018-03-27 |
| 9922964 | Package structure with dummy die | Li-Hsien Huang | 2018-03-20 |
| 9922939 | Wafer level shielding in multi-stacked fan out packages and methods of forming same | Wei-Yu Chen, An-Jhih Su, Jo-Mei Wang, Tien-Chung Yang | 2018-03-20 |
| 9911667 | Structure for die probing | — | 2018-03-06 |
| 9911707 | Structure and method of forming a pad structure having enhanced reliability | Ying-Ju Chen | 2018-03-06 |
| 9911687 | Molding compound structure | — | 2018-03-06 |
| 9911672 | Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devices | Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Kuan-Chung Lu | 2018-03-06 |
| 9881857 | Pad design for reliability enhancement in packages | Jie Chen | 2018-01-30 |
| 9859245 | Chip package structure with bump and method for forming the same | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2018-01-02 |
| 9859258 | Semiconductor device and method of manufacture | Wei-Yu Chen, Tien-Chung Yang, An-Jhih Su | 2018-01-02 |
| 9859235 | Underbump metallization structure | Yu-Wen Liu, Hao-Yi Tsai, Shin-Puu Jeng, Ying-Ju Chen, Shang-Yun Hou +2 more | 2018-01-02 |
| 9859242 | Post-passivation interconnect structure and method of forming same | Yi-Wen Wu | 2018-01-02 |
| 9859223 | Dicing structures for semiconductor substrates and methods of fabrication thereof | — | 2018-01-02 |