YL

Yan-Fu Lin

TSMC: 1 patents #1,476 of 2,904Top 55%
📍 Zhubeikou, TW: #69 of 117 inventorsTop 60%
Overall (2018): #187,796 of 503,207Top 40%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10163802 Fan-out package having a main die and a dummy die, and method of forming Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen 2018-12-25