Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163822 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2018-12-25 |
| 9922943 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2018-03-20 |