Issued Patents 2018
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922903 | Interconnect structure for package-on-package devices and a method of fabricating | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more | 2018-03-20 |
| 9911672 | Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devices | Chi-Hsi Wu, Hsien-Wei Chen, Li-Hsien Huang, Kuan-Chung Lu | 2018-03-06 |