Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163705 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2018-12-25 |
| 10157866 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2018-12-18 |
| 10115634 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2018-10-30 |
| 10074595 | Self-alignment for redistribution layer | Ku-Feng Yang, Ming-Tsu Chung, Hong-Ye Shih, Jiung Wu, Chen-Yu Tsai +2 more | 2018-09-11 |
| 10032698 | Interconnection structure with confinement layer | Hsiao Yun Lo, Yung-Chi Lin, Yang-Chih Hsueh, Wen-Chih Chiou | 2018-07-24 |
| 9978607 | Through via structure and method | Yung-Chi Lin, Hung-Pin Chang, Wen-Chih Chiou | 2018-05-22 |
| 9953920 | Interconnect structure and method | Hsin-Yu Chen, Ku-Feng Yang, Tasi-Jung Wu, Lin-Chih Huang, Yuan-Hung Liu +1 more | 2018-04-24 |
| 9865523 | Robust through-silicon-via structure | Yung-Chi Lin, Wen-Chih Chiou | 2018-01-09 |