Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157866 | Interconnect structure and method of forming same | Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2018-12-18 |
| 10032698 | Interconnection structure with confinement layer | Yung-Chi Lin, Yang-Chih Hsueh, Tsang-Jiuh Wu, Wen-Chih Chiou | 2018-07-24 |