Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157866 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Ku-Feng Yang +2 more | 2018-12-18 |
| 10068789 | Method of using a wafer cassette to charge an electrostatic carrier | Wen-Chih Chiou, Yu-Liang Lin, Hung-Jung Tu | 2018-09-04 |
| 10049931 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang | 2018-08-14 |
| 10032698 | Interconnection structure with confinement layer | Hsiao Yun Lo, Yang-Chih Hsueh, Tsang-Jiuh Wu, Wen-Chih Chiou | 2018-07-24 |
| 9978607 | Through via structure and method | Hung-Pin Chang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2018-05-22 |
| 9922934 | Semiconductor manufacturing process and package carrier | Shih-Hui Wang, Chih-Hung Cheng, Wen-Chih Chiou | 2018-03-20 |
| 9865523 | Robust through-silicon-via structure | Tsang-Jiuh Wu, Wen-Chih Chiou | 2018-01-09 |