Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163705 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Tsang-Jiuh Wu +3 more | 2018-12-25 |
| 10163709 | Semiconductor device and method | Chen-Hua Yu, Hung-Pin Chang, Yi-Hsiu Chen, Wen-Chih Chiou | 2018-12-25 |
| 10157866 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2018-12-18 |
| 10074595 | Self-alignment for redistribution layer | Ming-Tsu Chung, Hong-Ye Shih, Jiung Wu, Chen-Yu Tsai, Hsin-Yu Chen +2 more | 2018-09-11 |
| 9953920 | Interconnect structure and method | Hsin-Yu Chen, Tasi-Jung Wu, Lin-Chih Huang, Yuan-Hung Liu, Tsang-Jiuh Wu +1 more | 2018-04-24 |