Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163705 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Hong-Ye Shih, Ku-Feng Yang, Tsang-Jiuh Wu +3 more | 2018-12-25 |
| 10074595 | Self-alignment for redistribution layer | Ku-Feng Yang, Hong-Ye Shih, Jiung Wu, Chen-Yu Tsai, Hsin-Yu Chen +2 more | 2018-09-11 |