Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115634 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2018-10-30 |
| 9935197 | Semiconductor devices with low junction capacitances | Yu-Rung Hsu, Chen-Hua Yu | 2018-04-03 |