Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157864 | Package structure and method of forming the same | Chen-Hua Yu, Kuo-Chung Yee | 2018-12-18 |
| 9966360 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2018-05-08 |