Issued Patents 2018
Showing 51–75 of 148 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134717 | Semiconductor package, semiconductor device and method of forming the same | Chung-Shi Liu, Chih-Fan Huang, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng | 2018-11-20 |
| 10134708 | Package with thinned substrate | Chung-Hao Tsai, Chuei-Tang Wang | 2018-11-20 |
| 10128213 | Integrated fan-out stacked package with fan-out redistribution layer (RDL) | Kuo-Chung Yee, Hao-Yi Tsai, Tin-Hao Kuo | 2018-11-13 |
| 10121749 | Method of fabricating a post-passivation interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii | 2018-11-06 |
| 10115685 | Method of manufacturing a semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Wei-Ting Chen +2 more | 2018-10-30 |
| 10115634 | Semiconductor component having through-silicon vias and method of manufacture | Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2018-10-30 |
| 10109605 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai +1 more | 2018-10-23 |
| 10109613 | 3DIC stacking device and method of manufacture | Jing-Cheng Lin | 2018-10-23 |
| 10103125 | Chip package structure and method for forming the same | Jing-Cheng Lin, Po-Hao Tsai, An-Jhih Su | 2018-10-16 |
| 10097030 | Packaged semiconductor devices with wireless charging means | Hao-Yi Tsai, Tzu-Sung Huang, Ming Hung Tseng, Hung-Yi Kuo | 2018-10-09 |
| 10096571 | Chip-on-wafer package and method of forming same | Ming-Fa Chen, Sung-Feng Yeh | 2018-10-09 |
| 10090243 | Inductor for semiconductor integrated circuit | Hao-Hsiang Chuang, Jeng-Shien Hsieh, Chuei-Tang Wang | 2018-10-02 |
| 10090213 | Interposer test structures and methods | Tzuan-Horng Liu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2018-10-02 |
| 10090345 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Yung Ching Chen, Chien-Hsun Lee, Mirng-Ji Lii | 2018-10-02 |
| 10083940 | Package-on-package semiconductor device | Der-Chyang Yeh | 2018-09-25 |
| 10074629 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Ming-Fa Chen | 2018-09-11 |
| 10074472 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Vincent Chen, Hao-Yi Tsai, Ming Hung Tseng +1 more | 2018-09-11 |
| 10074631 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Shin-Puu Jeng, Hsien-Wei Chen, Der-Chyang Yeh, An-Jhih Su | 2018-09-11 |
| 10068868 | Multi-strike process for bonding packages and the packages thereof | Tung-Liang Shao, Chih-Hang Tung, Wen-Lin Shih, Hsiao-Yun Chen | 2018-09-04 |
| 10062821 | Light-emitting device | Ding-Yuan Chen, Chia-Lin Yu, Wen-Chih Chiou | 2018-08-28 |
| 10062648 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2018-08-28 |
| 10062654 | Semicondcutor structure and semiconductor manufacturing process thereof | Yu-Chia Lai, Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo +3 more | 2018-08-28 |
| 10056345 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Sheng-Yu Wu, Yao-Chun Chuang | 2018-08-21 |
| 10056267 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee | 2018-08-21 |
| 10056351 | Fan-out stacked system in package (SIP) and the methods of making the same | Kuo-Chung Yee | 2018-08-21 |