Issued Patents 2018
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163859 | Structure and formation method for chip package | Chen-Hua Yu, Ming-Fa Chen | 2018-12-25 |
| 10163799 | Semiconductor structure and method of manufacturing the same | Ming-Fa Chen | 2018-12-25 |
| 10163750 | Package structure for heat dissipation | Chen-Hua Yu, Ming-Fa Chen | 2018-12-25 |
| 10157882 | 3D chip-on-wafer-on-substrate structure with via last process | Chen-Hua Yu, Ming-Fa Chen, Wen-Ching Tsai | 2018-12-18 |
| 10157890 | Semiconductor structure and method of manufacturing the same | Chen-Hua Yu, Ming-Fa Chen | 2018-12-18 |
| 10096571 | Chip-on-wafer package and method of forming same | Chen-Hua Yu, Ming-Fa Chen | 2018-10-09 |
| 10074629 | System on integrated chips and methods of forming same | Chen-Hua Yu, Ming-Fa Chen | 2018-09-11 |
| 10026716 | 3DIC formation with dies bonded to formed RDLs | Chen-Hua Yu, Ming-Fa Chen | 2018-07-17 |
| 10014271 | Semiconductor structure and method of manufacturing the same | Chen-Hua Yu, Ming-Fa Chen | 2018-07-03 |
| 9899355 | Three-dimensional integrated circuit structure | Ching-Pin Yuan, Chen-Hua Yu, Ming-Fa Chen | 2018-02-20 |
| 9875982 | Semiconductor device and manufacturing method thereof | Ming-Fa Chen, Chen-Hua Yu, Ching-Pin Yuan | 2018-01-23 |
| 9859254 | Semiconductor structure and a manufacturing method thereof | Chen-Hua Yu, Ming-Fa Chen | 2018-01-02 |