Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157882 | 3D chip-on-wafer-on-substrate structure with via last process | Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh | 2018-12-18 |
WT
Wen-Ching Tsai
Overall (2018): #196,186 of 503,207Top 40%
1
Patents 2018