Issued Patents All Time
Showing 551–575 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9117881 | Conductive line system and process | Yu Yi Huang, Hung-Jui Kuo | 2015-08-25 |
| 9117816 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Kuei-Wei Huang | 2015-08-25 |
| 9111064 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang +1 more | 2015-08-18 |
| 9099396 | Post-passivation interconnect structure and method of forming the same | Yi-Wen Wu, Zheng-Yi Lim, Ming-Che Ho | 2015-08-04 |
| 9099467 | E-fuse structure design in electrical programmable redundancy for embedded memory circuit | Kong-Beng Thei, Chung Long Cheng, Harry-Hak-Lay Chuang, Shien-Yang Wu, Shi-Bai Chen | 2015-08-04 |
| 9099337 | Integrated circuits having negative channel metal oxide semiconductor and positive channel metal oxide semiconductor | Chen-Hua Yu | 2015-08-04 |
| 9093337 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang | 2015-07-28 |
| 9085049 | Method and system for manufacturing semiconductor device | Chien Ling Hwang, Bor-Ping Jang, Yi-Li Hsiao, Hsin-Hung Liao | 2015-07-21 |
| 9082636 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chun-Cheng Lin, Meng-Tse Chen +7 more | 2015-07-14 |
| 9082776 | Semiconductor package having protective layer with curved surface and method of manufacturing same | Wen-Hsiung Lu, Ming-Da Cheng, Yi-Wen Wu, Yu-Peng Tsai, Chia-Wei Tu | 2015-07-14 |
| 9073158 | Methods for forming 3DIC package | Meng-Tse Chen, Chun-Cheng Lin, Kuei-Wei Huang, Yu-Peng Tsai, Wei-Hung Lin +1 more | 2015-07-07 |
| 9059148 | Contact structure | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chih-Chun Chiu +1 more | 2015-06-16 |
| 9059109 | Package assembly and method of forming the same | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng | 2015-06-16 |
| 9054047 | Exposing connectors in packages through selective treatment | Chen-Hua Yu, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng | 2015-06-09 |
| 9048135 | Copper pillar bump with cobalt-containing sidewall protection | Chien Ling Hwang, Zheng-Yi Lim | 2015-06-02 |
| 9030022 | Packages and methods for forming the same | Meng-Tse Chen, Chun-Cheng Lin, Yu-Peng Tsai, Hsiu-Jen Lin, Ming-Da Cheng | 2015-05-12 |
| 9024431 | Semiconductor die contact structure and method | Chen-Hua Yu | 2015-05-05 |
| 9021682 | Apparatus for stud bump formation | Chien Ling Hwang, Yeong-Jyh Lin, Yi-Li Hsiao, Ming-Da Cheng, Tsai-Tsung Tsai +2 more | 2015-05-05 |
| 9018758 | Cu pillar bump with non-metal sidewall spacer and metal top cap | Chien Ling Hwang, Hui-Jung Tsai, Yi-Wen Wu | 2015-04-28 |
| 9010617 | Solder joint reflow process for reducing packaging failure rate | Chen-Hua Yu, Wen-Yao Chang, Chien Rhone Wang, Kewei Zuo | 2015-04-21 |
| 9006097 | Cu pillar bump with electrolytic metal sidewall protection | Wen-Hsiung Lu, Ming-Da Cheng, Chih-Wei Lin, Jacky Chang, Chen-Hua Yu | 2015-04-14 |
| 8993431 | Method of fabricating bump structure | Chun-Lei Hsu, Ming-Che Ho, Ming-Da Cheng | 2015-03-31 |
| 8987058 | Method for wafer separation | Yu-Peng Tsai, Wen-Hsiung Lu, Cheng-Ting Chen, Hsien-Wei Chen, Ming-Da Cheng | 2015-03-24 |
| 8987915 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Chang-Chia Huang, Chih-Wei Lin, Ming-Da Cheng | 2015-03-24 |
| 8981559 | Package on package devices and methods of packaging semiconductor dies | Chun-Lei Hsu, De-Yuan Lu, Ming-Che Ho, Yu-Feng Chen | 2015-03-17 |