Issued Patents All Time
Showing 576–600 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8975741 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Kuei-Wei Huang | 2015-03-10 |
| 8974617 | Method for transferring a graphene sheet to metal contact bumps of a substrate for use in semiconductor device package | Yu-Hsiang Hu | 2015-03-10 |
| 8951037 | Wafer-level underfill and over-molding | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang | 2015-02-10 |
| 8940618 | Method and device for cutting semiconductor wafers | Chien Ling Hwang, Lin-Wei Wang | 2015-01-27 |
| 8936730 | Methods for forming apparatus for stud bump formation | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Mirng-Ji Lii, Chen-Hua Yu +1 more | 2015-01-20 |
| 8937388 | Methods and apparatus of packaging semiconductor devices | Yi-Wen Wu, Ming-Che Ho, Wen-Hsiung Lu, Chia-Wei Tu | 2015-01-20 |
| 8927391 | Package-on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Chun-Cheng Lin, Kuei-Wei Huang +6 more | 2015-01-06 |
| 8928134 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Wei-Yu Chen, Meng-Tse Chen, Wei-Hung Lin, Ming-Da Cheng | 2015-01-06 |
| 8912044 | Method for bonding semiconductor substrates and devices obtained thereof | Yu-Hsiang Hu | 2014-12-16 |
| 8912651 | Package-on-package (PoP) structure including stud bulbs and method | Chen-Hua Yu, Mirng-Ji Lii, Ming-Da Cheng | 2014-12-16 |
| 8900922 | Fine-pitch package-on-package structures and methods for forming the same | Cheng-Chung Lin, Kuei-Wei Huang, Ai-Tee Ang, Tsai-Tsung Tsai, Ming-Da Cheng | 2014-12-02 |
| 8901726 | Package on package structure and method of manufacturing the same | Chun-Cheng Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng | 2014-12-02 |
| 8889486 | Methods and apparatus for package on package structures | Meng-Tse Chen, Yi-Da Tsai, Xi Chen, Tao-Hua Lee, Wei-Yu Chen +1 more | 2014-11-18 |
| 8884431 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Hsiu-Jen Lin, Bor-Ping Jang +7 more | 2014-11-11 |
| 8865585 | Method of forming post passivation interconnects | Meng-Wei Chou, Hung-Jui Kuo, Ming-Che Ho | 2014-10-21 |
| 8865586 | UBM formation for integrated circuits | Yi-Wen Wu, Zheng-Yi Lim, Ming-Che Ho | 2014-10-21 |
| 8853071 | Electrical connectors and methods for forming the same | Chun-Chieh Wang, Hung-Jui Kuo | 2014-10-07 |
| 8853002 | Methods for metal bump die assembly | Hsiu-Jen Lin, Ai-Tee Ang, Yu-Jen Tseng, Yu-Peng Tsai, Ming-Da Cheng | 2014-10-07 |
| 8846448 | Warpage control in a package-on-package structure | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Tsai-Tsung Tsai, Ai-Tee Ang +1 more | 2014-09-30 |
| 8841766 | Cu pillar bump with non-metal sidewall protection structure | Chien Ling Hwang, Yi-Wen Wu, Chun-Chieh Wang | 2014-09-23 |
| 8834662 | Apparatus and method of separating wafer from carrier | Chien Ling Hwang, Lin-Wei Wang | 2014-09-16 |
| 8835193 | Non-uniform alignment of wafer bumps with substrate solders | Hung-Jui Kuo, Chen-Hua Yu | 2014-09-16 |
| 8823166 | Pillar bumps and process for making same | Cheng-Chung Lin, Meng-Wei Chou, Kuo-Cheng Lin, Wen-Hsiung Lu, Chien Ling Hwang +2 more | 2014-09-02 |
| 8823167 | Copper pillar bump with non-metal sidewall protection structure and method of making the same | Yi-Wen Wu, Cheng-Chung Lin, Chien Ling Hwang | 2014-09-02 |
| 8809117 | Packaging process tools and packaging methods for semiconductor devices | Wen-Hsiung Lu, Ming-Da Cheng, Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin +1 more | 2014-08-19 |