Issued Patents All Time
Showing 601–625 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8791579 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang +1 more | 2014-07-29 |
| 8748306 | Cleaning residual molding compound on solder bumps | Yi-Yang Lei, Hung-Jui Kuo, Mirng-Ji Lii, Chen-Hua Yu | 2014-06-10 |
| 8735273 | Forming wafer-level chip scale package structures with reduced number of seed layers | Wen-Hsiung Lu, Ming-Da Cheng, Chih-Wei Lin, Yi-Wen Wu, Hsiu-Jen Lin +2 more | 2014-05-27 |
| 8729706 | Semiconductor structure having a permeable hard mask layer sealing an air gap | Chen-Hua Yu | 2014-05-20 |
| 8716858 | Bump structure with barrier layer on post-passivation interconnect | Chen-Fa Lu, Mirng-Ji Lii, Chen-Hua Yu | 2014-05-06 |
| 8710458 | UV exposure method for reducing residue in de-taping process | Yu-Hsiang Hu, Chen-Fa Lu | 2014-04-29 |
| 8703546 | Activation treatments in plating processes | Chih-Wei Lin, Ming-Da Cheng, Ming-Che Ho | 2014-04-22 |
| 8702871 | Package assembly cleaning process using vaporized solvent | Yi-Li Hsiao, Bor-Ping Jang, Kuei-Wei Huang, Lin-Wei Wang, Chien Ling Hwang | 2014-04-22 |
| 8679591 | Method for reducing voids in a copper-tin interface and structure formed thereby | Chien Ling Hwang, Yi-Li Hsiao | 2014-03-25 |
| 8674496 | System and method for fine pitch PoP structure | Cheng-Chung Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Chun-Cheng Lin, Ming-Da Cheng | 2014-03-18 |
| 8668131 | In-situ accuracy control in flux dipping | Yi-Li Hsiao, Chen-Hua Yu, Chien Ling Hwang | 2014-03-11 |
| 8664040 | Exposing connectors in packages through selective treatment | Chen-Hua Yu, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng | 2014-03-04 |
| 8664070 | High temperature gate replacement process | Chen-Hua Yu | 2014-03-04 |
| 8659155 | Mechanisms for forming copper pillar bumps | Ming-Da Cheng, Wen-Hsiung Lu, Chih-Wei Lin, Ching-Wen Chen, Yi-Wen Wu +2 more | 2014-02-25 |
| 8647796 | Photoactive compound gradient photoresist | Chen-Hua Yu, Hung-Jui Kuo | 2014-02-11 |
| 8642445 | Method and apparatus for reducing package warpage | Meng-Tse Chen, Hui-Min Huang, Chun-Cheng Lin, Chih-Chun Chiu, Ming-Da Cheng | 2014-02-04 |
| 8636559 | Method for wafer back-grinding control | Chen-Fa Lu, Chiang-Hao Lee, Wei-Yu Chen | 2014-01-28 |
| 8629050 | E-fuse structure design in electrical programmable redundancy for embedded memory circuit | Kong-Beng Thei, Chung Long Cheng, Harry-Hak-Lay Chuang, Shien-Yang Wu, Shi-Bai Chen | 2014-01-14 |
| 8629053 | Plasma treatment for semiconductor devices | Chen-Fa Lu, Chen-Hua Yu, Wei-Yu Chen, Cheng-Ting Chen | 2014-01-14 |
| 8629560 | Self aligned air-gap in interconnect structures | Chen-Hua Yu | 2014-01-14 |
| 8623755 | Self-aligned protection layer for copper post structure | Chen-Hua Yu | 2014-01-07 |
| 8618668 | Semiconductor contact barrier | Chen-Hua Yu | 2013-12-31 |
| 8617946 | Integrated circuits including metal gates and fabrication methods thereof | Chen-Hua Yu | 2013-12-31 |
| 8616433 | Forming low stress joints using thermal compress bonding | Kuei-Wei Huang, Wei-Hung Lin, Lin-Wei Wang, Bor-Ping Jang, Ming-Da Cheng | 2013-12-31 |
| 8609526 | Preventing UBM oxidation in bump formation processes | Cheng-Chung Lin, Ming-Che Ho, Kuo-Cheng Lin, Meng-Wei Chou | 2013-12-17 |