Issued Patents All Time
Showing 626–650 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8609462 | Methods for forming 3DIC package | Meng-Tse Chen, Chun-Cheng Lin, Kuei-Wei Huang, Yu-Peng Tsai, Wei-Hung Lin +1 more | 2013-12-17 |
| 8603860 | Process for forming packages | Meng-Tse Chen, Kuei-Wei Huang, Wei-Hung Lin, Wen-Hsiung Lu, Ming-Da Cheng | 2013-12-10 |
| 8586408 | Contact and method of formation | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chih-Chun Chiu +1 more | 2013-11-19 |
| 8587119 | Conductive feature for semiconductor substrate and method of manufacture | Chien Ling Hwang, Yi-Wen Wu | 2013-11-19 |
| 8581401 | Mechanisms for forming copper pillar bumps using patterned anodes | Wen-Hsiung Lu, Ming-Da Cheng, Chih-Wei Lin | 2013-11-12 |
| 8569897 | Protection layer for preventing UBM layer from chemical attack and oxidation | Chien Ling Hwang, Ming-Che Ho | 2013-10-29 |
| 8571699 | System and method to reduce pre-back-grinding process defects | Chen-Fa Lu, Cheng-Ting Chen, James Hu | 2013-10-29 |
| 8569887 | Post passivation interconnect with oxidation prevention layer | Chien Ling Hwang, Yi-Wen Wu | 2013-10-29 |
| 8556158 | Thermal compress bonding | Bor-Ping Jang, Kuei-Wei Huang, Wei-Hung Lin | 2013-10-15 |
| 8546254 | Mechanisms for forming copper pillar bumps using patterned anodes | Wen-Hsiung Lu, Ming-Da Cheng, Chih-Wei Lin | 2013-10-01 |
| 8540136 | Methods for stud bump formation and apparatus for performing the same | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Yi-Li Hsiao, Mirng-Ji Lii +1 more | 2013-09-24 |
| 8501615 | Metal bump formation | Ming-Da Cheng, Chih-Wei Lin, Hsiu-Jen Lin, Tzong-Hann Yang, Wen-Hsiung Lu +2 more | 2013-08-06 |
| 8501613 | UBM etching methods for eliminating undercut | Yi-Yang Lei, Hung-Jui Kuo, Mirng-Ji Lii, Chen-Hua Yu | 2013-08-06 |
| 8501616 | Self-aligned protection layer for copper post structure | Chen-Hua Yu | 2013-08-06 |
| 8492891 | Cu pillar bump with electrolytic metal sidewall protection | Wen-Hsiung Lu, Ming-Da Cheng, Chih-Wei Lin, Jacky Chang, Chen-Hua Yu | 2013-07-23 |
| 8446007 | Non-uniform alignment of wafer bumps with substrate solders | Hung-Jui Kuo, Chen-Hua Yu | 2013-05-21 |
| 8440562 | Germanium-containing dielectric barrier for low-K process | Chen-Hua Yu | 2013-05-14 |
| 8441124 | Cu pillar bump with non-metal sidewall protection structure | Yi-Wen Wu, Cheng-Chung Lin, Chien Ling Hwang | 2013-05-14 |
| 8440503 | Methods for performing reflow in bonding processes | Hsiu-Jen Lin, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng | 2013-05-14 |
| 8405199 | Conductive pillar for semiconductor substrate and method of manufacture | Wen-Hsiung Lu, Ming-Da Cheng, Chih-Wei Lin, Ming-Che Ho | 2013-03-26 |
| 8389397 | Method for reducing UBM undercut in metal bump structures | Yi-Yang Lei, Hung-Jui Kuo | 2013-03-05 |
| 8381965 | Thermal compress bonding | Bor-Ping Jang, Kuei-Wei Huang, Wei-Hung Lin | 2013-02-26 |
| 8377816 | Method of forming electrical connections | Shin-Puu Jeng, Mirng-Ji Lii, Chen-Hua Yu | 2013-02-19 |
| 8373269 | Jigs with controlled spacing for bonding dies onto package substrates | Yi-Li Hsiao, Chen-Hua Yu, Chien Ling Hwang | 2013-02-12 |
| 8360303 | Forming low stress joints using thermal compress bonding | Kuei-Wei Huang, Wei-Hung Lin, Lin-Wei Wang, Bor-Ping Jang, Ming-Da Cheng | 2013-01-29 |