Issued Patents All Time
Showing 676–700 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7285853 | Multilayer anti-reflective coating for semiconductor lithography and the method for forming the same | — | 2007-10-23 |
| 7186652 | Method for preventing Cu contamination and oxidation in semiconductor device manufacturing | Boq-Kang Hwu, Chen-Hua Yu | 2007-03-06 |
| 7187084 | Damascene method employing composite etch stop layer | Syun-Ming Jang, Chen-Hua Yu | 2007-03-06 |
| 7180193 | Via recess in underlying conductive line | Chen-Hua Yu, Horng-Huei Tseng | 2007-02-20 |
| 7125791 | Advanced copper damascene structure | — | 2006-10-24 |
| 7091600 | Prevention of post CMP defects in CU/FSG process | Shau-Lin Shue | 2006-08-15 |
| 6962771 | Dual damascene process | Chih-Cheng Lin | 2005-11-08 |
| 6875682 | Mesh pad structure to eliminate IMD crack on pad | Yuan-Lung Liu, Ruey-Yun Shiue | 2005-04-05 |
| 6876082 | Refractory metal nitride barrier layer with gradient nitrogen concentration | Hsien-Ming Lee, Shing-Chuang Pan, Chen-Hua Yu | 2005-04-05 |
| 6860769 | Cathode contact pin for an electroplating process | Chen-Hua Yu | 2005-03-01 |
| 6811670 | Method for forming cathode contact areas for an electroplating process | Chen-Hua Yu | 2004-11-02 |
| 6753259 | Method of improving the bondability between Au wires and Cu bonding pads | Syun-Ming Jang, Mong-Song Liang, Chen-Hua Yu, Jane-Bai Lai | 2004-06-22 |
| 6737352 | Method of preventing particle generation in plasma cleaning | Shau-Lin Shue, Chen-Hua Ya | 2004-05-18 |
| 6734110 | Damascene method employing composite etch stop layer | Syun-Ming Jang, Chen-Hua Yu | 2004-05-11 |
| 6734053 | Effective MIM fabrication method and apparatus to avoid breakdown and leakage on damascene copper process | Chen-Hua Yu | 2004-05-11 |
| 6723639 | Prevention of post CMP defects in Cu/FSG process | Shau-Lin Shue | 2004-04-20 |
| 6703286 | Metal bond pad for low-k inter metal dielectric | Chen-Hua Yu | 2004-03-09 |
| 6638853 | Method for avoiding photoresist resist residue on semioconductor feature sidewalls | Hung-Wen Sue, Wen-Chin Chiou, Keng-Chu Lin | 2003-10-28 |
| 6586347 | Method and structure to improve the reliability of multilayer structures of FSG (F-doped SiO2) dielectric layers and metal layers in semiconductor integrated circuits | Hui Wang, Szu-An Wu, Chun-Ching Tsan, Ying-Lang Wang, Tong-Hua Kuan | 2003-07-01 |
| 6586331 | Low sheet resistance of titanium salicide process | Chen-Hua Yu | 2003-07-01 |
| 6576551 | Chemical mechanical polish planarizing method with pressure compensating layer | Weng Chang | 2003-06-10 |
| 6562712 | Multi-step planarizing method for forming a patterned thermally extrudable material layer | Chen-Hua Yu | 2003-05-13 |
| 6544882 | Method to improve reliability of multilayer structures of FSG (F-doped SiO2) dielectric layers and aluminum-copper-TiN layers in integrated circuits | Shau-Lin Shue, Chen-Hua Yu | 2003-04-08 |
| 6500749 | Method to improve copper via electromigration (EM) resistance | Shau-Lin Shue, Chen-Hua Yu | 2002-12-31 |
| 6492269 | Methods for edge alignment mark protection during damascene electrochemical plating of copper | Shau-Lin Shue, Chen-Hua Yu, Ching-Hua Hsieh | 2002-12-10 |