Issued Patents All Time
Showing 701–725 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468873 | MIM formation method on CU damscene | Shau-Lin Shue | 2002-10-22 |
| 6423625 | Method of improving the bondability between Au wires and Cu bonding pads | Syun-Ming Jang, Mong-Song Liang, Chen-Hua Yu, Jane-Bai Lai | 2002-07-23 |
| 6424021 | Passivation method for copper process | Chen-Hua Yu | 2002-07-23 |
| 6413863 | Method to resolve the passivation surface roughness during formation of the AlCu pad for the copper process | Shau-Lin Shue, Chen-Hua Yu | 2002-07-02 |
| 6403465 | Method to improve copper barrier properties | Chen-Hua Yu | 2002-06-11 |
| 6399487 | Method of reducing phase transition temperature by using silicon-germanium alloys | Jane-Bai Lai, Lih-Juan Chen, Chen-Hua Yu | 2002-06-04 |
| 6395642 | Method to improve copper process integration | Chen-Hua Yu | 2002-05-28 |
| 6387800 | Method of forming barrier and seed layers for electrochemical deposition of copper | Shau-Lin Shue | 2002-05-14 |
| 6372645 | Methods to reduce metal bridges and line shorts in integrated circuits | Shau-Lin Shue, Chen-Hua Yu, Shih-Chi Lin, Ming-Jer Lee, Ying-Lang Wang +1 more | 2002-04-16 |
| 6353260 | Effective diffusion barrier | Shau-Lin Shue, Chen-Hua Yu | 2002-03-05 |
| 6350688 | Via RC improvement for copper damascene and beyond technology | Shau-Lin Shue, Chen-Hua Yu | 2002-02-26 |
| 6326300 | Dual damascene patterned conductor layer formation method | Chen-Hua Yu | 2001-12-04 |
| 6297158 | Stress management of barrier metal for resolving CU line corrosion | Shau-Lin Shue, Chen-Hua Yu | 2001-10-02 |
| 6294457 | Optimized IMD scheme for using organic low-k material as IMD layer | — | 2001-09-25 |
| 6287966 | Low sheet resistance of titanium salicide process | Chen-Hua Yu | 2001-09-11 |
| 6287961 | Dual damascene patterned conductor layer formation method without etch stop layer | Chen-Hua Yu | 2001-09-11 |
| 6277745 | Passivation method of post copper dry etching | Shau-Lin Shue, Syun-Ming Jang, Chen-Hua Yu | 2001-08-21 |
| 6271136 | Multi-step plasma process for forming TiSiN barrier | Shau-Lin Shue | 2001-08-07 |
| 6255734 | Passivated copper line semiconductor device structure | Chen-Hua Yu | 2001-07-03 |
| 6242338 | Method of passivating a metal line prior to deposition of a fluorinated silica glass layer | Shau-Lin Shue, Yao-Yi Cheng, Chen-Hua Yu, Mei-Yun Wang | 2001-06-05 |
| 6225223 | Method to eliminate dishing of copper interconnects | Chen-Hua Yu | 2001-05-01 |
| 6221758 | Effective diffusion barrier process and device manufactured thereby | Shau-Lin Shue, Chen-Hua Yu | 2001-04-24 |
| 6211075 | Method of improving metal stack reliability | Shau-Lin Shue, Chen-Hua Yu, Hung-Ju Chien | 2001-04-03 |
| 6211085 | Method of preparing CU interconnect lines | — | 2001-04-03 |
| 6207568 | Ionized metal plasma (IMP) method for forming (111) oriented aluminum containing conductor layer | Shau-Lin Shue, Chen-Hua Yu | 2001-03-27 |