Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6706637 | Dual damascene aperture formation method absent intermediate etch stop layer | Yu-Huei Chen, Sung-Ming Jang, Chen-Hua Yu | 2004-03-16 |
| 6667249 | Minimizing coating defects in low dielectric constant films | Yu-Hui Chen, Tien-I Bao | 2003-12-23 |
| 6472335 | Methods of adhesion promoter between low-K layer and underlying insulating layer | Chia-Shiung Tsai, Hun-Jan Tao | 2002-10-29 |
| 6331480 | Method to improve adhesion between an overlying oxide hard mask and an underlying low dielectric constant material | Chia-Shiung Tsai, Hun-Jan Tao | 2001-12-18 |
| 6255232 | Method for forming low dielectric constant spin-on-polymer (SOP) dielectric layer | Weng Chang, Syun-Ming Jang | 2001-07-03 |
| 6242338 | Method of passivating a metal line prior to deposition of a fluorinated silica glass layer | Chung-Shi Liu, Shau-Lin Shue, Chen-Hua Yu, Mei-Yun Wang | 2001-06-05 |
| 6187663 | Method of optimizing device performance via use of copper damascene structures, and HSQ/FSG, hybrid low dielectric constant materials | Chen-Hua Yu, Syun-Ming Jang, Weng Chang | 2001-02-13 |
| 6159842 | Method for fabricating a hybrid low-dielectric-constant intermetal dielectric (IMD) layer with improved reliability for multilevel interconnections | Weng Chang | 2000-12-12 |
| 6143670 | Method to improve adhesion between low dielectric constant layer and silicon containing dielectric layer | Syun-Ming Jang, Chia-Shiung Tsai, Chung-Shi Liu | 2000-11-07 |
| 6020273 | Method of stabilizing low dielectric constant films | Syun-Min Jang, Chen-Hua Yu | 2000-02-01 |
| 5795833 | Method for fabricating passivation layers over metal lines | Chen-Hua Yu | 1998-08-18 |