Issued Patents All Time
Showing 726–743 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6191025 | Method of fabricating a damascene structure for copper medullization | Chen-Hua Yu | 2001-02-20 |
| 6181013 | Method for selective growth of Cu3Ge or Cu5Si for passivation of damascene copper structures and device manufactured thereby | Chen-Hua Yu, Tien-I Bao, Syun-Ming Jang | 2001-01-30 |
| 6177347 | In-situ cleaning process for Cu metallization | Shau-Lin Shue, Chen-Hua Yu | 2001-01-23 |
| 6159857 | Robust post Cu-CMP IMD process | Chen-Hua Yu | 2000-12-12 |
| 6150272 | Method for making metal plug contacts and metal lines in an insulating layer by chemical/mechanical polishing that reduces polishing-induced damage | Chen-Hua Yu | 2000-11-21 |
| 6143657 | Method of increasing the stability of a copper to copper interconnection process and structure manufactured thereby | Chen-Hua Yu | 2000-11-07 |
| 6143670 | Method to improve adhesion between low dielectric constant layer and silicon containing dielectric layer | Yao-Yi Cheng, Syun-Ming Jang, Chia-Shiung Tsai | 2000-11-07 |
| 6136680 | Methods to improve copper-fluorinated silica glass interconnects | Jane-Bai Lai, Tien-I Bao, Syun-Ming Jang, Chung-Long Chang, Hui Wang +4 more | 2000-10-24 |
| 6130162 | Method of preparing passivated copper line and device manufactured thereby | Chen-Hua Yu | 2000-10-10 |
| 6130157 | Method to form an encapsulation layer over copper interconnects | Chen-Hua Yu | 2000-10-10 |
| 6107188 | Passivation method for copper process | Chen-Hua Yu | 2000-08-22 |
| 6099701 | AlCu electromigration (EM) resistance | Shau-Lin Shue, Chen-Hua Yu | 2000-08-08 |
| 6083829 | Use of a low resistivity Cu.sub.3 Ge interlayer as an adhesion promoter between copper and tin layers | Jane-Bai Lai, Lih-Juann Chen, Chen-Hua Yu | 2000-07-04 |
| 6080657 | Method of reducing AlCu hillocks | Shau-Lin Shue, Chen-Hua Yu | 2000-06-27 |
| 6046108 | Method for selective growth of Cu.sub.3 Ge or Cu.sub.5 Si for passivation of damascene copper structures and device manufactured thereby | Chen-Hua Yu, Tien-I Bao, Syun-Ming Jang | 2000-04-04 |
| 6037258 | Method of forming a smooth copper seed layer for a copper damascene structure | Chen-Hua Yu | 2000-03-14 |
| 6015749 | Method to improve adhesion between copper and titanium nitride, for copper interconnect structures, via the use of an ion implantation procedure | Chen-Hua Yu, Jane-Bai Lai, Lih-Juann Chen | 2000-01-18 |
| 6010962 | Copper chemical-mechanical-polishing (CMP) dishing | Chung-Long Chang, Chen-Hua Yu | 2000-01-04 |