Issued Patents All Time
Showing 651–675 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8344506 | Interface structure for copper-copper peeling integrity | Cheng-Chung Lin, Chen-Hua Yu | 2013-01-01 |
| 8324738 | Self-aligned protection layer for copper post structure | Chen-Hua Yu | 2012-12-04 |
| 8317077 | Thermal compressive bonding with separate die-attach and reflow processes | Chien Ling Hwang, Ying-Jui Huang, Cheng-Chung Lin | 2012-11-27 |
| 8319342 | Interconnect structures having permeable hard mask for sealing air gap contained by conductive structures | Chen-Hua Yu | 2012-11-27 |
| 8298041 | System and method for wafer back-grinding control | Chen-Fa Lu, Chiang-Hao Lee, Wei-Yu Chen | 2012-10-30 |
| 8294274 | Semiconductor contact barrier | Chen-Hua Yu | 2012-10-23 |
| 8258055 | Method of forming semiconductor die | Chien Ling Hwang, Ying-Jui Huang, Zheng-Yi Lim, Yi-Yang Lei, Cheng-Chung Lin | 2012-09-04 |
| 8242011 | Method of forming metal pillar | Zheng-Yi Lim, Yi-Wen Wu, Wen-Hsiung Lu, Chih-Wei Lin, Tzong-Huann Yang +2 more | 2012-08-14 |
| 8237272 | Conductive pillar structure for semiconductor substrate and method of manufacture | Hung-Jui Kuo, Chen-Hua Yu | 2012-08-07 |
| 8227334 | Doping minor elements into metal bumps | Ming-Da Cheng, Ming-Che Ho, Chien Ling Hwang, Cheng-Chung Lin, Hui-Jung Tsai +1 more | 2012-07-24 |
| 8198685 | Transistors with metal gate and methods for forming the same | Yung-Sheng Chiu, Cheng-Tung Lin, Chen-Hua Yu | 2012-06-12 |
| 8177862 | Thermal compressive bond head | Chien Ling Hwang, Cheng-Chung Lin, Ying-Jui Huang | 2012-05-15 |
| 8174091 | Fuse structure | Kong-Beng Thei, Chung Long Cheng, Harry Chuang, Shien-Yang Wu, Shi-Bai Chen | 2012-05-08 |
| 8104666 | Thermal compressive bonding with separate die-attach and reflow processes | Chien Ling Hwang, Ying-Jui Huang, Cheng-Chung Lin | 2012-01-31 |
| 8053357 | Prevention of post CMP defects in CU/FSG process | Shau-Lin Shue | 2011-11-08 |
| 8048717 | Method and system for bonding 3D semiconductor devices | Chen-Hua Yu, Yuh-Jier Mii, Yuan-Chen Sun | 2011-11-01 |
| 7897514 | Semiconductor contact barrier | Chen-Hua Yu | 2011-03-01 |
| 7871923 | Self-aligned air-gap in interconnect structures | Chen-Hua Yu | 2011-01-18 |
| 7871922 | Methods for forming interconnect structures that include forming air gaps between conductive structures | Chen-Hua Yu | 2011-01-18 |
| 7858519 | Integrated circuit and manufacturing method of copper germanide and copper silicide as copper capping layer | Chen-Hua Yu | 2010-12-28 |
| 7816789 | Germanium-containing dielectric barrier for low-k process | Chen-Hua Yu | 2010-10-19 |
| 7799628 | Advanced metal gate method and device | Hsiang-Yi Wang, Cheng-Tung Lin, Chen-Hua Yu | 2010-09-21 |
| 7759797 | Bonding pad structure to minimize IMD cracking | Yuan-Lung Liu, Ruey-Yun Shiue | 2010-07-20 |
| 7557449 | Flexible via design to improve reliability | — | 2009-07-07 |
| 7364836 | Dual damascene process | Chih-Cheng Lin | 2008-04-29 |