Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645825 | Planarization of shallow trench isolation (STI) | Chin Kun Lan, Ting-Chun Wang, Ying-Lang Wang | 2003-11-11 |
| 6586347 | Method and structure to improve the reliability of multilayer structures of FSG (F-doped SiO2) dielectric layers and metal layers in semiconductor integrated circuits | Chung-Shi Liu, Hui Wang, Szu-An Wu, Chun-Ching Tsan, Ying-Lang Wang | 2003-07-01 |
| 6551927 | CoSix process to improve junction leakage | Dian-Hau Chen, Kwang-Ming Lin, Yu-Ku Lin, Jin-Kuen Lan | 2003-04-22 |
| 6531382 | Use of a capping layer to reduce particle evolution during sputter pre-clean procedures | Tao Cheng, Wen-Hsin Huang, Jiun-Pyng You, Lin-June Wu, Shih-Tzung Chang +4 more | 2003-03-11 |
| 6291331 | Re-deposition high compressive stress PECVD oxide film after IMD CMP process to solve more than 5 metal stack via process IMD crack issue | Ying-Lang Wang, Jowei Dun, Ming-Jer Lee | 2001-09-18 |
| 6287172 | Method for improvement of tungsten chemical-mechanical polishing process | Hui Wang, Ying-Lang Wang, Chin Kun Lan | 2001-09-11 |
| 6248002 | Obtaining the better defect performance of the fuse CMP process by adding slurry polish on more soft pad after slurry polish | Hui Wang, Ying-Lang Wang, Yu-Ku Lin | 2001-06-19 |