CL

Chin Kun Lan

TSMC: 19 patents #1,728 of 12,232Top 15%
Overall (All Time): #229,260 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
12315812 Semiconductor structure having high breakdown voltage etch-stop layer Joung-Wei Liou 2025-05-27
12310257 Spacer scheme and method for MRAM Joung-Wei Liou 2025-05-20
12268096 Spacer stack for magnetic tunnel junctions Joung-Wei Liou 2025-04-01
11961803 Semiconductor structure having high breakdown voltage etch-stop layer Joung-Wei Liou 2024-04-16
11818964 Spacer scheme and method for MRAM Joung-Wei Liou 2023-11-14
11785858 Methods for forming a spacer stack for magnetic tunnel junctions Joung-Wei Liou 2023-10-10
11769692 High breakdown voltage inter-metal dielectric layer Joung-Wei Liou 2023-09-26
11488825 Multi-layer mask and method of forming same Joung-Wei Liou 2022-11-01
11283005 Spacer scheme and method for MRAM Joung-Wei Liou 2022-03-22
11139200 Multi-layer structure having a dense middle layer Joung-Wei Liou 2021-10-05
10879456 Sidewall spacer stack for magnetic tunnel junctions Joung-Wei Liou 2020-12-29
10748765 Multi-layer mask and method of forming same Joung-Wei Liou 2020-08-18
10510586 Multi-layer structure having a dense middle layer Joung-Wei Liou 2019-12-17
8669641 Diffusion region routing for narrow scribe-line devices Ming-Chang Hsieh, Hung-Lin Chen, Hsiu-Mei Yu, Dong-Lung Lee 2014-03-11
7968431 Diffusion region routing for narrow scribe-line devices Ming-Chang Hsieh, Hung-Lin Chen, Hsiu-Mei Yu, Dong-Lung Lee 2011-06-28
7955993 Oxygen plasma reduction to eliminate precursor overflow in BPTEOS film deposition Sheng-Wen Chen, Hung Jui Chang, Yu-Ku Lin, Ying-Lang Wang 2011-06-07
6645825 Planarization of shallow trench isolation (STI) Ting-Chun Wang, Tong-Hua Kuan, Ying-Lang Wang 2003-11-11
6407007 Method to solve the delamination of a silicon nitride layer from an underlying spin on glass layer Chun-Ching Tsan, Ying-Lang Wang, Hui Wang 2002-06-18
6287172 Method for improvement of tungsten chemical-mechanical polishing process Tong-Hua Kuan, Hui Wang, Ying-Lang Wang 2001-09-11