Issued Patents All Time
Showing 526–550 of 743 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287203 | Package-on-package structure and method of forming same | Chih-Wei Lin, Wen-Hsiung Lu, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng | 2016-03-15 |
| 9287171 | Method of making a conductive pillar bump with non-metal sidewall protection structure | Yi-Wen Wu, Cheng-Chung Lin, Chien Ling Hwang | 2016-03-15 |
| 9281288 | System and method for fine pitch PoP structure | Cheng-Chung Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Chun-Cheng Lin, Ming-Da Cheng | 2016-03-08 |
| 9275965 | Copper pillar bump with cobalt-containing sidewall protection layer | Chien Ling Hwang, Zheng-Yi Lim | 2016-03-01 |
| 9269687 | Packaging methods and packaged semiconductor devices | Meng-Tse Chen, Wei-Hung Lin, Yu-Peng Tsai, Chun-Cheng Lin, Chih-Wei Lin +1 more | 2016-02-23 |
| 9263839 | System and method for an improved fine pitch joint | Cheng-Ting Chen, Wen-Hsiung Lu, Ming-Da Cheng, Mirng-Ji Lii | 2016-02-16 |
| 9263412 | Packaging methods and packaged semiconductor devices | Wei-Hung Lin, Ming-Da Cheng, Wei-Yu Chen, Hsiu-Jen Lin, Kuei-Wei Huang | 2016-02-16 |
| 9263377 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Tsung-Ding Wang, Chen-Shien Chen, Jiun Yi Wu | 2016-02-16 |
| 9263302 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo | 2016-02-16 |
| 9257401 | Method of fabricating bump structure and bump structure | Chun-Lei Hsu, Ming-Che Ho, Ming-Da Cheng | 2016-02-09 |
| 9257333 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng | 2016-02-09 |
| 9257321 | Singulation apparatus and method | Chun-Cheng Lin, Yu-Peng Tsai, Meng-Tse Chen, Ming-Da Cheng | 2016-02-09 |
| 9252135 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2016-02-02 |
| 9230935 | Package on package structure and method of manufacturing the same | Chun-Cheng Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng | 2016-01-05 |
| 9219030 | Package on package structures and methods for forming the same | Chen-Hua Yu, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin, Ming-Da Cheng | 2015-12-22 |
| 9218999 | Packaging process tools and packaging methods for semiconductor devices | Wen-Hsiung Lu, Ming-Da Cheng, Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin +1 more | 2015-12-22 |
| 9214428 | Self-aligned protection layer for copper post structure | Chen-Hua Yu | 2015-12-15 |
| 9209149 | Bump-on-trace structures with high assembly yield | Chih-Fan Huang, Yi-Teh Chou, Ming-Da Cheng, Tin-Hao Kuo, Chen-Shien Chen | 2015-12-08 |
| 9196559 | Directly sawing wafers covered with liquid molding compound | Yu-Peng Tsai, Wen-Hsiung Lu, Chia-Wei Tu, Ming-Da Cheng | 2015-11-24 |
| 9165885 | Staggered via redistribution layer (RDL) for a package and a method for forming the same | Chen-Hua Yu, Hung-Jui Kuo | 2015-10-20 |
| 9136167 | Method of making a pillar structure having a non-metal sidewall protection structure | Chien Ling Hwang, Yi-Wen Wu, Chun-Chieh Wang | 2015-09-15 |
| 9129899 | Method and system for thinning wafer thereof | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao | 2015-09-08 |
| 9123553 | Method and system for bonding 3D semiconductor device | Chen-Hua Yu, Yuh-Jier Mii, Yuan-Chen Sun | 2015-09-01 |
| 9123763 | Package-on-package (PoP) structure having at least one package comprising one die being disposed in a core material between first and second surfaces of the core material | Chen-Hua Yu, Mirng-Ji Lii, Ming-Da Cheng, Chih-Wei Lin | 2015-09-01 |
| 9117772 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho | 2015-08-25 |