Issued Patents All Time
Showing 76–100 of 175 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7429402 | Ruthenium as an underlayer for tungsten film deposition | Srinivas Gandikota, Madhu Moorthy, Amit Khandelwal, Avgerinos V. Gelatos, Kavita Shah +1 more | 2008-09-30 |
| 7404985 | Noble metal layer formation for copper film deposition | Ling Chen | 2008-07-29 |
| 7402210 | Apparatus and method for hybrid chemical processing | Ling Chen, Vincent Ku, Dien-Yeh Wu, Hua Chung | 2008-07-22 |
| 7396480 | Method for front end of line fabrication | Chien-Teh Kao, Jing-Pei (Connie) Chou, Chiukin (Steven) Lai, Sal Umotoy, Joel M. Huston +6 more | 2008-07-08 |
| 7384867 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos +7 more | 2008-06-10 |
| 7352048 | Integration of barrier layer and seed layer | Hua Chung, Ling Chen, Jick Yu | 2008-04-01 |
| 7270709 | Method and apparatus of generating PDMAT precursor | Ling Chen, Vincent Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli +3 more | 2007-09-18 |
| 7264846 | Ruthenium layer formation for copper film deposition | Seshadri Ganguli, Nirmalya Maity | 2007-09-04 |
| 7262133 | Enhancement of copper line reliability using thin ALD tan film to cap the copper line | Ling Chen | 2007-08-28 |
| 7204886 | Apparatus and method for hybrid chemical processing | Ling Chen, Vincent Ku, Dien-Yeh Wu, Hua Chung | 2007-04-17 |
| 7049226 | Integration of ALD tantalum nitride for copper metallization | Hua Chung, Nirmalya Maity, Jick Yu, Roderick C. Mosely | 2006-05-23 |
| 7026238 | Reliability barrier integration for Cu application | Ming Xi, Paul Smith, Ling Chen, Michael Yang, Fusen Chen +2 more | 2006-04-11 |
| 6939804 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos +7 more | 2005-09-06 |
| 6936906 | Integration of barrier layer and seed layer | Hua Chung, Ling Chen, Jick Yu | 2005-08-30 |
| 6932871 | Multi-station deposition apparatus and method | Lawrence Chung-Lai Lei, Walter Glenn | 2005-08-23 |
| 6933021 | Method of TiSiN deposition using a chemical vapor deposition (CVD) process | Jing-Pei (Connie) Chou, Chien-Teh Kao, Chiukin Lai, Roderick C. Mosely | 2005-08-23 |
| 6908865 | Method and apparatus for cleaning substrates | Martin Kranz, Srinivas Guggilla, Suraj Rengarajan, Gongda Yao, Nitin Khurana +1 more | 2005-06-21 |
| 6905541 | Method and apparatus of generating PDMAT precursor | Ling Chen, Vincent Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli +3 more | 2005-06-14 |
| 6849545 | System and method to form a composite film stack utilizing sequential deposition techniques | Alfred Mak, Jeong Soo Byun, Hua Chung, Ashok Sinha, Moris Kori | 2005-02-01 |
| 6821891 | Atomic layer deposition of copper using a reducing gas and non-fluorinated copper precursors | Ling Chen | 2004-11-23 |
| 6705246 | RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition | Sujit Sharan, Gurtej S. Sandhu, Paul Smith | 2004-03-16 |
| 6699530 | Method for constructing a film on a semiconductor wafer | Michal Danek, Marvin Liao, Eric A. Englhardt, Yeh-Jen Kao, Dale R. DuBois +1 more | 2004-03-02 |
| 6607976 | Copper interconnect barrier layer structure and formation method | Ling Chen, Seshadri Ganguli, Christophe Marcadal, Wei Cao, Roderick C. Mosely | 2003-08-19 |
| 6555183 | Plasma treatment of a titanium nitride film formed by chemical vapor deposition | Shulin Wang, Ming Xi, Zvi Lando | 2003-04-29 |
| 6548402 | Method of depositing a thick titanium nitride film | Shulin Wang, Ming Xi, Frederick Wu, Ramanujapuram A. Srinivas, Yehuda Demayo +2 more | 2003-04-15 |