Issued Patents All Time
Showing 76–100 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763248 | Multi-layer silicon/gallium nitride semiconductor | Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Ravi Pillarisetty, Kimin Jun +3 more | 2020-09-01 |
| 10720345 | Wafer to wafer bonding with low wafer distortion | Mauro J. Kobrinsky, Myra McDonnell, Brennen Mueller, Chytra Pawashe, Daniel Pantuso +2 more | 2020-07-21 |
| 10714446 | Apparatus with multi-wafer based device comprising embedded active and/or passive devices and method for forming such | Anup Pancholi, Prashant Majhi, Patrick Morrow | 2020-07-14 |
| 10673405 | Film bulk acoustic resonator (FBAR) devices with 2DEG bottom electrode | Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Bruce A. Block | 2020-06-02 |
| 10672884 | Schottky diodes on semipolar planes of group III-N material structures | Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then | 2020-06-02 |
| 10658475 | Transistors with vertically opposed source and drain metal interconnect layers | Han Wui Then, Sansaptak Dasgupta, Marko Radosavljevic | 2020-05-19 |
| 10627427 | Manufacturing advanced test probes | Roy E. Swart, Charlotte C. Kwong | 2020-04-21 |
| 10573715 | Backside isolation for integrated circuit | Aaron D. Lilak, Rishabh Mehandru, Harold W. Kennel, Stephen M. Cea | 2020-02-25 |
| 10529827 | Long channel MOS transistors for low leakage applications on a short channel CMOS chip | Rishabh Mehandru, Patrick Morrow, Aaron D. Lilak, Stephen M. Cea | 2020-01-07 |
| 10522510 | Heterogeneous integration of ultrathin functional block by solid phase adhesive and selective transfer | Kimin Jun, Jacob Jensen, Patrick Morrow | 2019-12-31 |
| 10490449 | Techniques for revealing a backside of an integrated circuit device, and associated configurations | Il-Seok Son, Colin T. Carver, Patrick Morrow, Kimin Jun | 2019-11-26 |
| 10453679 | Methods and devices integrating III-N transistor circuitry with Si transistor circuitry | Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Ravi Pillarisetty, Kimin Jun +3 more | 2019-10-22 |
| 10396045 | Metal on both sides of the transistor integrated with magnetic inductors | Patrick Morrow | 2019-08-27 |
| 10367070 | Methods of forming backside self-aligned vias and structures formed thereby | Patrick Morrow, Mauro J. Kobrinsky, Kimin Jun, Il-Seok Son | 2019-07-30 |
| 10236282 | Partial layer transfer system and method | Patrick Morrow, Kimin Jun, Il-Seok Son, Rajashree Baskaran | 2019-03-19 |
| 9921640 | Integrated voltage regulators with magnetically enhanced inductors | Uwe Zillmann, Andre Schaefer, Ruchir Saraswat, Telesphor Kamgaing, Guido Droege | 2018-03-20 |
| 9835648 | Liquid metal interconnects | Rajashree Baskaran, Kimin Jun, Ting Zhong, Roy E. Swart | 2017-12-05 |
| 9786559 | Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (TSVs) | Paul A. Zimmerman, Scott B. Clendenning, Patricio E. Romero, Robert Edgeworth | 2017-10-10 |
| 9461010 | Debond interconnect structures | Qing Ma, Jun He, Patrick Morrow, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-10-04 |
| 9391447 | Interposer to regulate current for wafer test tooling | Evan M. Fledell, Roy E. Swart, Timothy J. Maloney, Jack D. Pippin | 2016-07-12 |
| 9269686 | Debond interconnect structures | Qing Ma, Jun He, Patrick Morrow, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-02-23 |
| 9177831 | Die assembly on thin dielectric sheet | Chia-Pin Chiu, Qing Ma, Robert L. Sankman, Patrick Morrow, William J. Lambert +2 more | 2015-11-03 |
| 8637778 | Debond interconnect structures | Qing Ma, Jun He, Patrick Morrow, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2014-01-28 |
| 8513966 | Probes formed from semiconductor region vias | Qing Ma, Roy E. Swart, Johanna M. Swan | 2013-08-20 |
| 7666465 | Introducing nanotubes in trenches and structures formed thereby | Anne Miller, Kenneth Cadien, Chris Barns | 2010-02-23 |