Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786559 | Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (TSVs) | Paul A. Zimmerman, Scott B. Clendenning, Patricio E. Romero, Paul B. Fischer | 2017-10-10 |
| 7787696 | Systems and methods for adaptive sampling and estimating a systematic relationship between a plurality of points | Robert Wilhelm | 2010-08-31 |