Issued Patents All Time
Showing 101–110 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7476974 | Method to fabricate interconnect structures | Tatyana N. Andreyushchenko, Kenneth Cadien, Valery M. Dubin | 2009-01-13 |
| 7371685 | Low stress barrier layer removal | — | 2008-05-13 |
| 7205236 | Semiconductor substrate polishing methods and equipment | Chris Barns | 2007-04-17 |
| 7186637 | Method of bonding semiconductor devices | Grant Kloster, Shriram Ramanathan, Chin-Chang Chen | 2007-03-06 |
| 7105925 | Differential planarization | James A. Boardman, Sarah Kim, Mauro J. Kobrinsky | 2006-09-12 |
| 7087517 | Method to fabricate interconnect structures | Tatyana N. Andreyushchenko, Kenneth Cadien, Valery M. Dubin | 2006-08-08 |
| 6914002 | Differential planarization | James A. Boardman, Sarah Kim, Mauro J. Kobrinsky | 2005-07-05 |
| 6887131 | Polishing pad design | Lei Jiang, Sadasivan Shankar | 2005-05-03 |
| 6358853 | Ceria based slurry for chemical-mechanical polishing | Kenneth Cadien, Allen D. Feller, Mark Buehler | 2002-03-19 |
| 5595526 | Method and apparatus for endpoint detection in a chemical/mechanical process for polishing a substrate | Leopoldo D. Yau | 1997-01-21 |