Issued Patents All Time
Showing 101–125 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10998302 | Packaged device with a chiplet comprising memory resources | Adel A. Elsherbini, Van H. Le, Johanna M. Swan, Shawna M. Liff, Gerald Pasdast +1 more | 2021-05-04 |
| 10978590 | Methods and apparatus to remove epitaxial defects in semiconductors | Aaron D. Lilak, Rishabh Mehandru, Patrick H. Keys | 2021-04-13 |
| 10944399 | Multi-level spin logic | Sasikanth Manipatruni, Ian A. Young, Dmitri E. Nikonov, Uygar E. Avci, Anurag Chaudhry | 2021-03-09 |
| 10937665 | Methods and apparatus for gettering impurities in semiconductors | Aaron D. Lilak, Harold W. Kennel, Rishabh Mehandru, Stephen M. Cea | 2021-03-02 |
| 10910405 | Backside fin recess control with multi-HSI option | Aaron D. Lilak, Stephen M. Cea, Rishabh Mehandru, Cory E. Weber | 2021-02-02 |
| 10896847 | Techniques for revealing a backside of an integrated circuit device, and associated configurations | Il-Seok Son, Colin T. Carver, Paul B. Fischer, Kimin Jun | 2021-01-19 |
| 10892337 | Backside source/drain replacement for semiconductor devices with metallization on both sides | Glenn A. Glass, Karthik Jambunathan, Anand S. Murthy, Chandra S. Mohapatra, Mauro J. Kobrinsky | 2021-01-12 |
| 10892215 | Metal on both sides with power distributed through the silicon | Donald W. Nelson, Mark Bohr | 2021-01-12 |
| 10886217 | Integrated circuit device with back-side interconnection to deep source/drain semiconductor | Mauro J. Kobrinsky, Mark Bohr, Tahir Ghani, Rishabh Mehandru | 2021-01-05 |
| 10872820 | Integrated circuit structures | Bruce A. Block, Valluri Rao, Rishabh Mehandru, Doug B. Ingerly, Kimin Jun +3 more | 2020-12-22 |
| 10861870 | Inverted staircase contact for density improvement to 3D stacked devices | Aaron D. Lilak, Rishabh Mehandru | 2020-12-08 |
| 10847635 | Vertical integration scheme and circuit elements architecture for area scaling of semiconductor devices | Rishabh Mehandru, Ranjith Kumar, Cory E. Weber, Seiyon Kim, Stephen M. Cea +1 more | 2020-11-24 |
| 10797139 | Methods of forming backside self-aligned vias and structures formed thereby | Mauro J. Kobrinsky, Kimin Jun, Il-Seok Son, Paul B. Fischer | 2020-10-06 |
| 10784358 | Backside contact structures and fabrication for metal on both sides of devices | Rishabh Mehandru, Aaron D. Lilak, Kimin Jun | 2020-09-22 |
| 10763248 | Multi-layer silicon/gallium nitride semiconductor | Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Ravi Pillarisetty, Kimin Jun +3 more | 2020-09-01 |
| 10734412 | Backside contact resistance reduction for semiconductor devices with metallization on both sides | Glenn A. Glass, Anand S. Murthy, Karthik Jambunathan, Chandra S. Mohapatra, Mauro J. Kobrinsky | 2020-08-04 |
| 10714446 | Apparatus with multi-wafer based device comprising embedded active and/or passive devices and method for forming such | Anup Pancholi, Prashant Majhi, Paul B. Fischer | 2020-07-14 |
| 10700039 | Silicon die with integrated high voltage devices | Donald W. Nelson, M. Clair Webb, Kimin Jun | 2020-06-30 |
| 10672831 | High density memory architecture using back side metal layers | Yih Wang | 2020-06-02 |
| 10658291 | Metal on both sides with clock gated-power and signal routing underneath | Donald W. Nelson, Kimin Jun | 2020-05-19 |
| 10636907 | Deep EPI enabled by backside reveal for stress enhancement and contact | Aaron D. Lilak, Stephen M. Cea, Rishabh Mehandru, Patrick H. Keys | 2020-04-28 |
| 10600810 | Backside fin recess control with multi-hsi option | Aaron D. Lilak, Stephen M. Cea, Rishabh Mehandru, Cory E. Weber | 2020-03-24 |
| 10529827 | Long channel MOS transistors for low leakage applications on a short channel CMOS chip | Rishabh Mehandru, Paul B. Fischer, Aaron D. Lilak, Stephen M. Cea | 2020-01-07 |
| 10522510 | Heterogeneous integration of ultrathin functional block by solid phase adhesive and selective transfer | Kimin Jun, Jacob Jensen, Paul B. Fischer | 2019-12-31 |
| 10490542 | Integrated circuit layout using library cells with alternating conductive lines | Donald W. Nelson, Steven M. Burns | 2019-11-26 |