| 11037916 |
Apparatus with multi-wafer based device comprising embedded active devices and method for forming such |
Anup Pancholi, Prashant Majhi, Paul B. Fischer |
2021-06-15 |
$33,380,000 |
| 11011537 |
Vertical interconnect methods for stacked device architectures using direct self assembly with high operational parallelization and improved scalability |
Aaron D. Lilak, Patrick Theofanis, Rishabh Mehandru, Stephen M. Cea |
2021-05-18 |
$44,170,000 |
| 10998302 |
Packaged device with a chiplet comprising memory resources |
Adel A. Elsherbini, Van H. Le, Johanna M. Swan, Shawna M. Liff, Gerald Pasdast +1 more |
2021-05-04 |
$37,420,000 |
| 10978590 |
Methods and apparatus to remove epitaxial defects in semiconductors |
Aaron D. Lilak, Rishabh Mehandru, Patrick H. Keys |
2021-04-13 |
$58,007,000 |
| 10944399 |
Multi-level spin logic |
Sasikanth Manipatruni, Ian A. Young, Dmitri E. Nikonov, Uygar E. Avci, Anurag Chaudhry |
2021-03-09 |
$45,039,000 |
| 10937665 |
Methods and apparatus for gettering impurities in semiconductors |
Aaron D. Lilak, Harold W. Kennel, Rishabh Mehandru, Stephen M. Cea |
2021-03-02 |
$34,569,000 |
| 10910405 |
Backside fin recess control with multi-HSI option |
Aaron D. Lilak, Stephen M. Cea, Rishabh Mehandru, Cory E. Weber |
2021-02-02 |
$28,243,000 |
| 10896847 |
Techniques for revealing a backside of an integrated circuit device, and associated configurations |
Il-Seok Son, Colin T. Carver, Paul B. Fischer, Kimin Jun |
2021-01-19 |
$115,732,000 |
| 10892337 |
Backside source/drain replacement for semiconductor devices with metallization on both sides |
Glenn A. Glass, Karthik Jambunathan, Anand S. Murthy, Chandra S. Mohapatra, Mauro J. Kobrinsky |
2021-01-12 |
$55,416,000 |
| 10892215 |
Metal on both sides with power distributed through the silicon |
Donald W. Nelson, Mark Bohr |
2021-01-12 |
$55,416,000 |
| 10886217 |
Integrated circuit device with back-side interconnection to deep source/drain semiconductor |
Mauro J. Kobrinsky, Mark Bohr, Tahir Ghani, Rishabh Mehandru |
2021-01-05 |
$27,050,000 |
| 10872820 |
Integrated circuit structures |
Bruce A. Block, Valluri Rao, Rishabh Mehandru, Doug B. Ingerly, Kimin Jun +3 more |
2020-12-22 |
$47,741,000 |
| 10861870 |
Inverted staircase contact for density improvement to 3D stacked devices |
Aaron D. Lilak, Rishabh Mehandru |
2020-12-08 |
$30,873,000 |
| 10847635 |
Vertical integration scheme and circuit elements architecture for area scaling of semiconductor devices |
Rishabh Mehandru, Ranjith Kumar, Cory E. Weber, Seiyon Kim, Stephen M. Cea +1 more |
2020-11-24 |
$25,522,000 |
| 10797139 |
Methods of forming backside self-aligned vias and structures formed thereby |
Mauro J. Kobrinsky, Kimin Jun, Il-Seok Son, Paul B. Fischer |
2020-10-06 |
$29,609,000 |
| 10784358 |
Backside contact structures and fabrication for metal on both sides of devices |
Rishabh Mehandru, Aaron D. Lilak, Kimin Jun |
2020-09-22 |
$34,575,000 |
| 10763248 |
Multi-layer silicon/gallium nitride semiconductor |
Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Ravi Pillarisetty, Kimin Jun +3 more |
2020-09-01 |
$24,773,000 |
| 10734412 |
Backside contact resistance reduction for semiconductor devices with metallization on both sides |
Glenn A. Glass, Anand S. Murthy, Karthik Jambunathan, Chandra S. Mohapatra, Mauro J. Kobrinsky |
2020-08-04 |
$32,661,000 |
| 10714446 |
Apparatus with multi-wafer based device comprising embedded active and/or passive devices and method for forming such |
Anup Pancholi, Prashant Majhi, Paul B. Fischer |
2020-07-14 |
$28,563,000 |
| 10700039 |
Silicon die with integrated high voltage devices |
Donald W. Nelson, M. Clair Webb, Kimin Jun |
2020-06-30 |
$33,333,000 |
| 10672831 |
High density memory architecture using back side metal layers |
Yih Wang |
2020-06-02 |
$32,838,000 |
| 10658291 |
Metal on both sides with clock gated-power and signal routing underneath |
Donald W. Nelson, Kimin Jun |
2020-05-19 |
$31,576,000 |
| 10636907 |
Deep EPI enabled by backside reveal for stress enhancement and contact |
Aaron D. Lilak, Stephen M. Cea, Rishabh Mehandru, Patrick H. Keys |
2020-04-28 |
$36,717,000 |
| 10600810 |
Backside fin recess control with multi-hsi option |
Aaron D. Lilak, Stephen M. Cea, Rishabh Mehandru, Cory E. Weber |
2020-03-24 |
$21,125,000 |
| 10529827 |
Long channel MOS transistors for low leakage applications on a short channel CMOS chip |
Rishabh Mehandru, Paul B. Fischer, Aaron D. Lilak, Stephen M. Cea |
2020-01-07 |
$22,293,000 |
