| 11393777 |
Microelectronic assemblies |
Adel A. Elsherbini, Henning Braunisch, Kimin Jun, Brennen Mueller, Shawna M. Liff +2 more |
2022-07-19 |
$11,394,000 |
| 11393818 |
Stacked transistors with Si PMOS and high mobility thin film transistor NMOS |
Gilbert Dewey, Ravi Pillarisetty, Abhishek A. Sharma, Aaron D. Lilak, Willy Rachmady +5 more |
2022-07-19 |
$11,394,000 |
| 11387238 |
Non-silicon N-Type and P-Type stacked transistors for integrated circuit devices |
Gilbert Dewey, Ravi Pillarisetty, Rishabh Mehandru, Cheng-Ying Huang, Willy Rachmady +1 more |
2022-07-12 |
$13,106,000 |
| 11380684 |
Stacked transistor architecture including nanowire or nanoribbon thin film transistors |
Gilbert Dewey, Aaron D. Lilak, Cheng-Ying Huang, Jack T. Kavalieros, Willy Rachmady +4 more |
2022-07-05 |
$18,093,000 |
| 11374004 |
Pedestal fin structure for stacked transistor integration |
Aaron D. Lilak, Rishabh Mehandru, Anh Phan, Gilbert Dewey, Willy Rachmady +5 more |
2022-06-28 |
$15,065,000 |
| 11348897 |
Microelectronic assemblies |
Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more |
2022-05-31 |
$16,893,000 |
| 11342227 |
Stacked transistor structures with asymmetrical terminal interconnects |
Aaron D. Lilak, Ehren Mannebach, Nafees Kabir, Gilbert Dewey, Willy Rachmady +1 more |
2022-05-24 |
$18,289,000 |
| 11328951 |
Transistor cells including a deep via lined wit h a dielectric material |
Mauro J. Kobrinsky, Rishabh Mehandru |
2022-05-10 |
$19,182,000 |
| 11264405 |
Semiconductor diodes employing back-side semiconductor or metal |
Rishabh Mehandru, Nathan Jack |
2022-03-01 |
$16,941,000 |
| 11264493 |
Wrap-around source/drain method of making contacts for backside metals |
Kimin Jun, Il-Seok Son, Donald W. Nelson |
2022-03-01 |
$16,941,000 |
| 11257738 |
Vertically stacked transistor devices with isolation wall structures containing an electrical conductor |
Aaron D. Lilak, Anh Phan, Stephanie A. Bojarski |
2022-02-22 |
$16,582,000 |
| 11257929 |
Stacked transistors |
Rishabh Mehandru, Aaron D. Lilak |
2022-02-22 |
$16,582,000 |
| 11251156 |
Fabrication and use of through silicon vias on double sided interconnect device |
Brennen Mueller, Kimin Jun, Paul B. Fischer, Daniel Pantuso |
2022-02-15 |
$14,138,000 |
| 11239232 |
Isolation walls for vertically stacked transistor structures |
Aaron D. Lilak, Gilbert Dewey, Willy Rachmady, Rishabh Mehandru |
2022-02-01 |
$16,992,000 |
| 11239236 |
Forksheet transistor architectures |
Aaron D. Lilak, Rishabh Mehandru, Ehren Mannebach, Willy Rachmady |
2022-02-01 |
$16,992,000 |
| 11205630 |
Vias in composite IC chip structures |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Mauro Kobrinksy, Van H. Le +1 more |
2021-12-21 |
$33,282,000 |
| 11201221 |
Backside contact structures and fabrication for metal on both sides of devices |
Rishabh Mehandru, Aaron D. Lilak, Kimin Jun |
2021-12-14 |
$41,312,000 |
| 11139241 |
Integrated circuit device with crenellated metal trace layout |
Mauro J. Kobrinsky, Mark Bohr, Tahir Ghani, Rishabh Mehandru, Ranjith Kumar |
2021-10-05 |
$23,463,000 |
| 11107924 |
Systems and methods to reduce FinFET gate capacitance |
Aaron D. Lilak, Rishabh Mehandru |
2021-08-31 |
$22,590,000 |
| 11107811 |
Metallization structures under a semiconductor device layer |
Aaron D. Lilak, Rishabh Mehandru, Stephen M. Cea |
2021-08-31 |
$22,590,000 |
| 11094672 |
Composite IC chips including a chiplet embedded within metallization layers of a host IC chip |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Gerald Pasdast, Van H. Le |
2021-08-17 |
$29,127,000 |
| 11075202 |
Bottom fin trim isolation aligned with top gate for stacked device architectures |
Aaron D. Lilak, Gilbert Dewey, Willy Rachmady, Rishabh Mehandru |
2021-07-27 |
$27,337,000 |
| 11075119 |
Vertically stacked transistors in a pin |
Aaron D. Lilak, Sean T. Ma, Justin R. Weber, Rishabh Mehandru |
2021-07-27 |
$27,337,000 |
| 11049861 |
Method, device and system to provide capacitance for a dynamic random access memory cell |
Aaron D. Lilak, Rishabh Mehandru, Donald W. Nelson, Stephen M. Cea |
2021-06-29 |
$34,663,000 |
| 11037817 |
Apparatus with multi-wafer based device and method for forming such |
Anup Pancholi, Prashant Majhi, Paul B. Fischer |
2021-06-15 |
$33,380,000 |
