Patent Leaderboard
USPTO Patent Rankings Data through Sept 30, 2025
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Patrick Morrow

INIntel: 186 patents #69 of 30,777Top 1%
INIntle: 1 patents #1 of 16Top 7%
Portland, OR: #32 of 9,213 inventorsTop 1%
Oregon: #67 of 28,073 inventorsTop 1%
Overall (All Time): #3,872 of 4,157,543Top 1%
187 Patents All Time

Issued Patents All Time

Showing 76–100 of 187 patents

Patent #TitleCo-InventorsDate
11387238 Non-silicon N-Type and P-Type stacked transistors for integrated circuit devices Gilbert Dewey, Ravi Pillarisetty, Rishabh Mehandru, Cheng-Ying Huang, Willy Rachmady +1 more 2022-07-12
11380684 Stacked transistor architecture including nanowire or nanoribbon thin film transistors Gilbert Dewey, Aaron D. Lilak, Cheng-Ying Huang, Jack T. Kavalieros, Willy Rachmady +4 more 2022-07-05
11374004 Pedestal fin structure for stacked transistor integration Aaron D. Lilak, Rishabh Mehandru, Anh Phan, Gilbert Dewey, Willy Rachmady +5 more 2022-06-28
11348897 Microelectronic assemblies Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more 2022-05-31
11342227 Stacked transistor structures with asymmetrical terminal interconnects Aaron D. Lilak, Ehren Mannebach, Nafees Kabir, Gilbert Dewey, Willy Rachmady +1 more 2022-05-24
11328951 Transistor cells including a deep via lined wit h a dielectric material Mauro J. Kobrinsky, Rishabh Mehandru 2022-05-10
11264405 Semiconductor diodes employing back-side semiconductor or metal Rishabh Mehandru, Nathan Jack 2022-03-01
11264493 Wrap-around source/drain method of making contacts for backside metals Kimin Jun, Il-Seok Son, Donald W. Nelson 2022-03-01
11257929 Stacked transistors Rishabh Mehandru, Aaron D. Lilak 2022-02-22
11257738 Vertically stacked transistor devices with isolation wall structures containing an electrical conductor Aaron D. Lilak, Anh Phan, Stephanie A. Bojarski 2022-02-22
11251156 Fabrication and use of through silicon vias on double sided interconnect device Brennen Mueller, Kimin Jun, Paul B. Fischer, Daniel Pantuso 2022-02-15
11239232 Isolation walls for vertically stacked transistor structures Aaron D. Lilak, Gilbert Dewey, Willy Rachmady, Rishabh Mehandru 2022-02-01
11239236 Forksheet transistor architectures Aaron D. Lilak, Rishabh Mehandru, Ehren Mannebach, Willy Rachmady 2022-02-01
11205630 Vias in composite IC chip structures Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Mauro Kobrinksy, Van H. Le +1 more 2021-12-21
11201221 Backside contact structures and fabrication for metal on both sides of devices Rishabh Mehandru, Aaron D. Lilak, Kimin Jun 2021-12-14
11139241 Integrated circuit device with crenellated metal trace layout Mauro J. Kobrinsky, Mark Bohr, Tahir Ghani, Rishabh Mehandru, Ranjith Kumar 2021-10-05
11107924 Systems and methods to reduce FinFET gate capacitance Aaron D. Lilak, Rishabh Mehandru 2021-08-31
11107811 Metallization structures under a semiconductor device layer Aaron D. Lilak, Rishabh Mehandru, Stephen M. Cea 2021-08-31
11094672 Composite IC chips including a chiplet embedded within metallization layers of a host IC chip Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Gerald Pasdast, Van H. Le 2021-08-17
11075119 Vertically stacked transistors in a pin Aaron D. Lilak, Sean T. Ma, Justin R. Weber, Rishabh Mehandru 2021-07-27
11075202 Bottom fin trim isolation aligned with top gate for stacked device architectures Aaron D. Lilak, Gilbert Dewey, Willy Rachmady, Rishabh Mehandru 2021-07-27
11049861 Method, device and system to provide capacitance for a dynamic random access memory cell Aaron D. Lilak, Rishabh Mehandru, Donald W. Nelson, Stephen M. Cea 2021-06-29
11037817 Apparatus with multi-wafer based device and method for forming such Anup Pancholi, Prashant Majhi, Paul B. Fischer 2021-06-15
11037916 Apparatus with multi-wafer based device comprising embedded active devices and method for forming such Anup Pancholi, Prashant Majhi, Paul B. Fischer 2021-06-15
11011537 Vertical interconnect methods for stacked device architectures using direct self assembly with high operational parallelization and improved scalability Aaron D. Lilak, Patrick Theofanis, Rishabh Mehandru, Stephen M. Cea 2021-05-18