Issued Patents All Time
Showing 151–175 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490201 | Methods of forming under device interconnect structures | Don Nelson, M. Clair Webb, Kimin Jun, Il-Seok Son | 2016-11-08 |
| 9461010 | Debond interconnect structures | Qing Ma, Jun He, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-10-04 |
| 9420707 | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same | Qing Ma, Chuan Hu | 2016-08-16 |
| 9269686 | Debond interconnect structures | Qing Ma, Jun He, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-02-23 |
| 9177831 | Die assembly on thin dielectric sheet | Chia-Pin Chiu, Qing Ma, Robert L. Sankman, Paul B. Fischer, William J. Lambert +2 more | 2015-11-03 |
| 8637778 | Debond interconnect structures | Qing Ma, Jun He, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2014-01-28 |
| 8421225 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Scott List, Michael Chan, Mauro J. Kobrinsky, Sarah Kim +3 more | 2013-04-16 |
| 8203208 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Scott List, Michael Chan, Mauro J. Kobrinsky, Sarah Kim +3 more | 2012-06-19 |
| 7973407 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Scott List, Michael Chan, Mauro J. Kobrinsky, Sarah Kim +3 more | 2011-07-05 |
| 7800371 | Portable NMR device and method for making and using the same | Chang-Min Park, Shriram Ramanathan, Kenneth Cadien | 2010-09-21 |
| 7755124 | Laminating magnetic materials in a semiconductor device | Arnel M. Fajardo, Ebrahim Andideh, Changmin Park | 2010-07-13 |
| 7745940 | Forming ultra dense 3-D interconnect structures | — | 2010-06-29 |
| 7723759 | Stacked wafer or die packaging with enhanced thermal and device performance | Rajashree Baskaran, Shriram Ramanathan | 2010-05-25 |
| 7682916 | Field effect transistor structure with abrupt source/drain junctions | Anand S. Murthy, Robert S. Chau, Chia-Hong Jan, Paul Packan | 2010-03-23 |
| 7436035 | Method of fabricating a field effect transistor structure with abrupt source/drain junctions | Anand S. Murthy, Robert S. Chau, Chia-Hong Jan, Paul Packan | 2008-10-14 |
| 7410884 | 3D integrated circuits using thick metal for backside connections and offset bumps | Shriram Ramanathan, Sarah Kim | 2008-08-12 |
| 7402509 | Method of forming self-passivating interconnects and resulting devices | Mauro J. Kobrinsky, Jun He, Kevin P. O'Brien, Ying Zhou, Shriram Ramanathan | 2008-07-22 |
| 7391087 | MOS transistor structure and method of fabrication | Anand S. Murthy, Robert S. Chau | 2008-06-24 |
| 7345479 | Portable NMR device and method for making and using the same | Chang-Min Park, Shriram Ramanathan, Kenneth Cadien | 2008-03-18 |
| 7338873 | Method of fabricating a field effect transistor structure with abrupt source/drain junctions | Anand S. Murthy, Robert S. Chau, Chia-Hong Jan, Paul Packan | 2008-03-04 |
| 7274191 | Integrated on-chip NMR and ESR device and method for making and using the same | Chang-Min Park, Shriram Ramanathan, Kenneth Cadien | 2007-09-25 |
| 7217595 | Sealed three dimensional metal bonded integrated circuits | Grant Kloster | 2007-05-15 |
| 7214605 | Deposition of diffusion barrier | Shriram Ramanathan, Grant Kloster, Vijayakumar Ramachandrarao, Scott List | 2007-05-08 |
| 7214594 | Method of making semiconductor device using a novel interconnect cladding layer | Lawrence Wong, Jihperng Leu, Grant Kloster, Andrew Ott | 2007-05-08 |
| 7180180 | Stacked device underfill and a method of fabrication | Grant Kloster, Michael Goodner, Shriram Ramanathan | 2007-02-20 |