| 9640634 |
Field effect transistor structure with abrupt source/drain junctions |
Anand S. Murthy, Robert S. Chau, Chia-Hong Jan, Paul Packan |
2017-05-02 |
$12,076,000 |
| 9590051 |
Heterogeneous layer device |
Kimin Jun |
2017-03-07 |
$9,849,000 |
| 9490201 |
Methods of forming under device interconnect structures |
Don Nelson, M. Clair Webb, Kimin Jun, Il-Seok Son |
2016-11-08 |
$9,907,000 |
| 9461010 |
Debond interconnect structures |
Qing Ma, Jun He, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more |
2016-10-04 |
$11,494,000 |
| 9420707 |
Substrate for integrated circuit devices including multi-layer glass core and methods of making the same |
Qing Ma, Chuan Hu |
2016-08-16 |
$10,311,000 |
| 9269686 |
Debond interconnect structures |
Qing Ma, Jun He, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more |
2016-02-23 |
$10,383,000 |
| 9177831 |
Die assembly on thin dielectric sheet |
Chia-Pin Chiu, Qing Ma, Robert L. Sankman, Paul B. Fischer, William J. Lambert +2 more |
2015-11-03 |
$14,434,000 |
| 8637778 |
Debond interconnect structures |
Qing Ma, Jun He, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more |
2014-01-28 |
$20,482,000 |
| 8421225 |
Three-dimensional stacked substrate arrangements |
Shriram Ramanathan, Scott List, Michael Chan, Mauro J. Kobrinsky, Sarah Kim +3 more |
2013-04-16 |
$28,862,000 |
| 8203208 |
Three-dimensional stacked substrate arrangements |
Shriram Ramanathan, Scott List, Michael Chan, Mauro J. Kobrinsky, Sarah Kim +3 more |
2012-06-19 |
$20,138,000 |
| 7973407 |
Three-dimensional stacked substrate arrangements |
Shriram Ramanathan, Scott List, Michael Chan, Mauro J. Kobrinsky, Sarah Kim +3 more |
2011-07-05 |
$27,745,000 |
| 7800371 |
Portable NMR device and method for making and using the same |
Chang-Min Park, Shriram Ramanathan, Kenneth Cadien |
2010-09-21 |
$10,255,000 |
| 7755124 |
Laminating magnetic materials in a semiconductor device |
Arnel M. Fajardo, Ebrahim Andideh, Changmin Park |
2010-07-13 |
$17,820,000 |
| 7745940 |
Forming ultra dense 3-D interconnect structures |
— |
2010-06-29 |
$12,144,000 |
| 7723759 |
Stacked wafer or die packaging with enhanced thermal and device performance |
Rajashree Baskaran, Shriram Ramanathan |
2010-05-25 |
$11,401,000 |
| 7682916 |
Field effect transistor structure with abrupt source/drain junctions |
Anand S. Murthy, Robert S. Chau, Chia-Hong Jan, Paul Packan |
2010-03-23 |
$13,395,000 |
| 7436035 |
Method of fabricating a field effect transistor structure with abrupt source/drain junctions |
Anand S. Murthy, Robert S. Chau, Chia-Hong Jan, Paul Packan |
2008-10-14 |
$13,671,000 |
| 7410884 |
3D integrated circuits using thick metal for backside connections and offset bumps |
Shriram Ramanathan, Sarah Kim |
2008-08-12 |
$20,410,000 |
| 7402509 |
Method of forming self-passivating interconnects and resulting devices |
Mauro J. Kobrinsky, Jun He, Kevin P. O'Brien, Ying Zhou, Shriram Ramanathan |
2008-07-22 |
$18,979,000 |
| 7391087 |
MOS transistor structure and method of fabrication |
Anand S. Murthy, Robert S. Chau |
2008-06-24 |
$20,489,000 |
| 7345479 |
Portable NMR device and method for making and using the same |
Chang-Min Park, Shriram Ramanathan, Kenneth Cadien |
2008-03-18 |
$17,443,000 |
| 7338873 |
Method of fabricating a field effect transistor structure with abrupt source/drain junctions |
Anand S. Murthy, Robert S. Chau, Chia-Hong Jan, Paul Packan |
2008-03-04 |
$16,330,000 |
| 7274191 |
Integrated on-chip NMR and ESR device and method for making and using the same |
Chang-Min Park, Shriram Ramanathan, Kenneth Cadien |
2007-09-25 |
$25,540,000 |
| 7217595 |
Sealed three dimensional metal bonded integrated circuits |
Grant Kloster |
2007-05-15 |
$17,522,000 |
| 7214594 |
Method of making semiconductor device using a novel interconnect cladding layer |
Lawrence Wong, Jihperng Leu, Grant Kloster, Andrew Ott |
2007-05-08 |
$17,693,000 |
