Issued Patents All Time
Showing 176–200 of 220 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7882623 | Apparatus for removing interconnects to separate two parts of a workpiece | Ray Jackson, David C. Linnell, Frank L. Pompeo | 2011-02-08 |
| 7867887 | Structure and method for enhancing resistance to fracture of bonding pads | Ian D. Melville, Dae Young Jung | 2011-01-11 |
| 7855137 | Method of making a sidewall-protected metallic pillar on a semiconductor substrate | Waldemar Walter Kocon, Kevin S. Petrarca, Richard P. Volant | 2010-12-21 |
| 7819376 | Techniques for forming interconnects | David Danovitch, Peter A. Gruber, John U. Knickerbocker, George R. Proto, Da-Yuan Shih | 2010-10-26 |
| 7816248 | Solder connector structure and method | Lacrtis Economikos, Ian D. Melville, Kevin S. Petrarca, Richard P. Volant | 2010-10-19 |
| 7806341 | Structure for implementing secure multichip modules for encryption applications | Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D. Kadakia, David C. Long +2 more | 2010-10-05 |
| 7786588 | Composite interconnect structure using injection molded solder technique | David Danovitch, Michael A. Gaynes | 2010-08-31 |
| 7755206 | Pad structure to provide improved stress relief | John A. Fitzsimmons, Thomas J. Fleischman | 2010-07-13 |
| 7731077 | Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders | Charles C. Goldsmith | 2010-06-08 |
| 7714452 | Structure and method for producing multiple size interconnections | Lawrence A. Clevenger, Louis L. Hsu, William Francis Landers, Donna S. Zupanski-Nielson, Carl Radens +1 more | 2010-05-11 |
| 7696631 | Wire bonding personalization and discrete component attachment on wirebond pads | Frederic Beaulieu, Kevin S. Petrarca | 2010-04-13 |
| 7674690 | Inhibition of metal diffusion arising from laser dicing | Robert Hannon, Da-young Jung | 2010-03-09 |
| 7648891 | Semiconductor chip shape alteration | Dae Young Jung, Ian D. Melville | 2010-01-19 |
| 7635643 | Method for forming C4 connections on integrated circuit chips and the resulting devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Kevin S. Petrarca, Wolfgang Sauter | 2009-12-22 |
| 7622737 | Test structures for electrically detecting back end of the line failures and methods of making and using the same | Xiao Hu Liu, Ian D. Melville | 2009-11-24 |
| 7573115 | Structure and method for enhancing resistance to fracture of bonding pads | Ian D. Melville, Dae Young Jung | 2009-08-11 |
| 7566637 | Method of inhibition of metal diffusion arising from laser dicing | Robert Hannon, Dae Young Jung | 2009-07-28 |
| 7566649 | Compressible films surrounding solder connectors | William E. Bernier, Tien-Jen Cheng, Marie Cole, David E. Eichstadt, John A. Fitzsimmons +4 more | 2009-07-28 |
| 7531384 | Enhanced interconnect structure | Chih-Chao Yang, Keith Kwong Hon Wong, Haining Yang | 2009-05-12 |
| 7473580 | Temporary chip attach using injection molded solder | Thomas J. Fleischman | 2009-01-06 |
| 7472836 | Method and structure for implementing secure multichip modules for encryption applications | Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D. Kadakia, David C. Long +2 more | 2009-01-06 |
| 7470985 | Solder connector structure and method | Laertis Economikos, Ian D. Melville, Kevin S. Petrarca, Richard P. Volant | 2008-12-30 |
| 7452215 | Ball grid array rework using a continuous belt furnace | Ray Jackson, David C. Linnell, Frank L. Pompeo | 2008-11-18 |
| 7445141 | Solder interconnection array with optimal mechanical integrity | Glenn G. Daves, David L. Edwards, Frank L. Pompeo | 2008-11-04 |
| 7442878 | Low stress conductive polymer bump | William E. Bernier, Marie Cole, John U. Knickerbocker, Tasha E. Lopez, Roger A. Quon +1 more | 2008-10-28 |