Issued Patents All Time
Showing 201–220 of 220 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7375021 | Method and structure for eliminating aluminum terminal pad material in semiconductor devices | Daniel C. Edelstein, Robert Hannon, Ian D. Melville | 2008-05-20 |
| 7348270 | Techniques for forming interconnects | David Danovitch, Peter A. Gruber, John U. Knickerbocker, George R. Proto, Da-Yuan Shih | 2008-03-25 |
| 7332821 | Compressible films surrounding solder connectors | William E. Bernier, Tien-Jen Cheng, Marie Cole, David E. Eichstadt, John A. Fitzsimmons +4 more | 2008-02-19 |
| 7316572 | Compliant electrical contacts | William E. Bernier, David E. Eichstadt, John U. Knickerbocker | 2008-01-08 |
| 7312529 | Structure and method for producing multiple size interconnections | Lawrence A. Clevenger, Louis L. Hsu, William Francis Landers, Donna S. Zupanski-Nielsen, Carl Radens +1 more | 2007-12-25 |
| 7299530 | Ball grid array rework using a continuous belt furnace | Ray Jackson, David C. Linnell, Frank L. Pompeo | 2007-11-27 |
| 7287685 | Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders | Charles C. Goldsmith | 2007-10-30 |
| 7281667 | Method and structure for implementing secure multichip modules for encryption applications | Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D. Kadakia, David C. Long +2 more | 2007-10-16 |
| 7245022 | Semiconductor module with improved interposer structure and method for forming the same | John U. Knickerbocker, Frank L. Pompeo, Subhash L. Shinde | 2007-07-17 |
| 7234218 | Method for separating electronic component from organic board | Harvey C. Hamel | 2007-06-26 |
| 7170187 | Low stress conductive polymer bump | William E. Bernier, Marie Cole, John U. Knickerbocker, Tasha E. Lopez, Roger A. Quon +1 more | 2007-01-30 |
| 7079393 | Fluidic cooling systems and methods for electronic components | Evan G. Colgan, Frank L. Pompeo, Glenn G. Daves, Hilton T. Toy, Bruce K. Furman +7 more | 2006-07-18 |
| 6987316 | Multilayer ceramic substrate with single via anchored pad and method of forming | Srinivasa N. Reddy, Kevin M. Prettyman | 2006-01-17 |
| 6943108 | Interposer capacitor built on silicon wafer and joined to a ceramic substrate | John U. Knickerbocker, Srinivasa S. N. Reddy, Robert A. Rita | 2005-09-13 |
| 6917113 | Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly | Mario J. Interrante | 2005-07-12 |
| 6892925 | Solder hierarchy for lead free solder joint | Mario J. Interrante, William E. Sablinski | 2005-05-17 |
| 6854636 | Structure and method for lead free solder electronic package interconnections | Mario J. Interrante, William E. Sablinski | 2005-02-15 |
| 6791133 | Interposer capacitor built on silicon wafer and joined to a ceramic substrate | John U. Knickerbocker, Srinivasa S. N. Reddy, Robert A. Rita | 2004-09-14 |
| 6719188 | Rework methods for lead BGA/CGA | Raymond A. Jackson, David C. Linnell | 2004-04-13 |
| 6541305 | Single-melt enhanced reliability solder element interconnect | Raymond A. Jackson | 2003-04-01 |