Issued Patents All Time
Showing 126–150 of 169 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6575177 | Semiconductor substrate cleaning system | Brian J. Brown, Anwar Husain | 2003-06-10 |
| 6572453 | Multi-fluid polishing process | Kapila Wijekoon, Stan Tsai, Yuchun Wang, Doyle E. Bennett, Madhavi R. Chandrachood +1 more | 2003-06-03 |
| 6569349 | Additives to CMP slurry to polish dielectric films | Yuchun Wang, Rajeev Bajaj | 2003-05-27 |
| 6561873 | Method and apparatus for enhanced CMP using metals having reductive properties | Stan Tsai, Yuchun Wang, Kapila Wijekoon, Rajeev Bajaj | 2003-05-13 |
| 6537144 | Method and apparatus for enhanced CMP using metals having reductive properties | Stan Tsai, Yuchun Wang, Kapila Wijekoon, Rajeev Bajaj | 2003-03-25 |
| 6523553 | Wafer edge cleaning method and apparatus | Brian J. Brown, Michael Sugarman | 2003-02-25 |
| 6520840 | CMP slurry for planarizing metals | Yuchun Wang, Rajeev Bajaj | 2003-02-18 |
| 6509269 | Elimination of pad glazing for Al CMP | Lizhong Sun, Shijian Li | 2003-01-21 |
| 6506097 | Optical monitoring in a two-step chemical mechanical polishing process | Bret W. Adams, Boguslaw A. Swedek, Rajeev Bajaj, Savitha Nanjangud, Andreas Norbert Wiswesser +3 more | 2003-01-14 |
| 6485359 | Platen arrangement for a chemical-mechanical planarization apparatus | Shijian Li, John M. White, Manoocher Birang | 2002-11-26 |
| 6468362 | Method and apparatus for cleaning/drying hydrophobic wafers | Youfel Chen, Brian J. Brown, Boris Fishkin | 2002-10-22 |
| 6465051 | Method of operating high density plasma CVD reactor with combined inductive and capacitive coupling | Turgut Sahin, Romuald Nowak, Shijian Li, Timothy Dyer, Derek R. Witty | 2002-10-15 |
| 6436832 | Method to reduce polish initiation time in a polish process | Yutao Ma, Juilung Li, Tse-Yong Yao, Rajeev Bajaj | 2002-08-20 |
| 6435942 | Chemical mechanical polishing processes and components | Raymond R. Jin, Jeffrey Drue David, Thomas H. Osterheld | 2002-08-20 |
| 6435944 | CMP slurry for planarizing metals | Yuchun Wang, Rajeev Bajaj | 2002-08-20 |
| 6436302 | Post CU CMP polishing for reduced defects | Juy-Lung Li, Tse-Yong Yao, Rajeev Bajaj, Yutao Ma | 2002-08-20 |
| 6432826 | Planarized Cu cleaning for reduced defects | Ramin Emami, Shijian Li, Sen-Hou Ko, Madhavi R. Chandrachood | 2002-08-13 |
| 6416823 | Deposition chamber and method for depositing low dielectric constant films | Shijian Li, Yaxin Wang, Tetsuya Ishikawa, Alan W. Collins | 2002-07-09 |
| 6379223 | Method and apparatus for electrochemical-mechanical planarization | Lizhong Sun, Stan Tsai | 2002-04-30 |
| 6358124 | Pad conditioner cleaning apparatus | Raijiro Koga, Hiromi Tsuruta, Takashi Kumagai, Gee Sun Hoey, Brian J. Brown +5 more | 2002-03-19 |
| 6309276 | Endpoint monitoring with polishing rate change | Stan Tsai, Kapila Wijekoon | 2001-10-30 |
| 6273806 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | Doyle E. Bennett, Thomas H. Osterheld, Ginnetto Addiego | 2001-08-14 |
| 6251187 | Gas distribution in deposition chambers | Shijian Li, Tetsuya Ishikawa | 2001-06-26 |
| 6220201 | High density plasma CVD reactor with combined inductive and capacitive coupling | Romuald Nowak, Kevin Fairbairn | 2001-04-24 |
| 6220942 | CMP platen with patterned surface | Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney P. Huey | 2001-04-24 |