FR

Fred C. Redeker

Applied Materials: 109 patents #32 of 7,310Top 1%
Lam Research: 60 patents #19 of 2,128Top 1%
📍 Fremont, CA: #22 of 9,298 inventorsTop 1%
🗺 California: #786 of 386,348 inventorsTop 1%
Overall (All Time): #4,795 of 4,157,543Top 1%
169
Patents All Time

Issued Patents All Time

Showing 151–169 of 169 patents

Patent #TitleCo-InventorsDate
6217430 Pad conditioner cleaning apparatus Raijiro Koga, Hiromi Tsuruta, Takashi Kumagai, Gee Sun Hoey, Brian J. Brown +1 more 2001-04-17
6182602 Inductively coupled HDP-CVD reactor Romuald Nowak, Tetsuya Ishikawa, Troy S. Detrick, Jay D. Pinson, II 2001-02-06
6179709 In-situ monitoring of linear substrate polishing operations Manoocher Birang, Shijian Li, Sasson Somekh 2001-01-30
6170428 Symmetric tunable inductively coupled HDP-CVD reactor Farhad Moghadam, Hiroji Hanawa, Tetsuya Ishikawa, Dan Maydan, Shijian Li +5 more 2001-01-09
6162368 Technique for chemical mechanical polishing silicon Shijian Li, Thomas H. Osterheld 2000-12-19
6083344 Multi-zone RF inductively coupled source configuration Hiroji Hanawa, Tetsuya Ishikawa, Manus Wong, Shijian Li, Kaveh Niazi +3 more 2000-07-04
6070551 Deposition chamber and method for depositing low dielectric constant films Shijian Li, Yaxin Wang, Tetsuya Ishikawa, Alan W. Collins 2000-06-06
6015591 Deposition method Shijian Li, Tetsuya Ishikawa 2000-01-18
5984769 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus Doyle E. Bennett, Thomas H. Osterheld, Ginetto Addiego 1999-11-16
5944902 Plasma source for HDP-CVD chamber Tetsuya Ishikawa 1999-08-31
5865896 High density plasma CVD reactor with combined inductive and capacitive coupling Romuald Nowak, Kevin Fairbairn 1999-02-02
5800621 Plasma source for HDP-CVD chamber Tetsuya Ishikawa 1998-09-01
5788799 Apparatus and method for cleaning of semiconductor process chamber surfaces Robert Steger 1998-08-04
5772771 Deposition chamber for improved deposition thickness uniformity Shijian Li, Tetsuya Ishikawa 1998-06-30
5761023 Substrate support with pressure zones having reduced contact area and temperature feedback Brian Lue, Tetsuya Ishikawa, Manus Wong, Shijian Li 1998-06-02
5748434 Shield for an electrostatic chuck Kent Rossman, Brian Lue 1998-05-05
5705225 Method of filling pores in anodized aluminum parts Charles Dornfest, Mark Fodor, Craig Bercaw, H. Steven Tomozawa 1998-01-06
5454903 Plasma cleaning of a CVD or etch reactor using helium for plasma stabilization Charles Dornfest, John Y. Leong 1995-10-03
5292399 Plasma etching apparatus with conductive means for inhibiting arcing Terrance Y. Lee, Petru N. Nitescu, Robert Steger, David W. Groechel, Semyon Sherstinsky +2 more 1994-03-08