Issued Patents All Time
Showing 101–125 of 169 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6863593 | Chemical mechanical polishing a substrate having a filler layer and a stop layer | Raymond R. Jin, Shijian Li, Thomas H. Osterheld | 2005-03-08 |
| 6858540 | Selective removal of tantalum-containing barrier layer during metal CMP | Lizhong Sun, Stan Tsai, Shijian Li | 2005-02-22 |
| 6858265 | Technique for improving chucking reproducibility | Robert Steger, Shijian Li | 2005-02-22 |
| 6855043 | Carrier head with a modified flexible membrane | Jianshe Tang, Brian J. Brown, Charles C. Garretson, Benjamin A. Bonner, Thomas H. Osterheld | 2005-02-15 |
| 6832948 | Thermal preconditioning fixed abrasive articles | Manoocher Birang, Ramin Emami, Shijian Li | 2004-12-21 |
| 6833052 | Deposition chamber and method for depositing low dielectric constant films | Shijian Li, Yaxin Wang, Tetsuya Ishikawa, Alan W. Collins | 2004-12-21 |
| 6797074 | Wafer edge cleaning method and apparatus | Brian J. Brown, Michael Sugarman | 2004-09-28 |
| 6796880 | Linear polishing sheet with window | Manoocher Birang, Shijian Li, Sasson Somekh | 2004-09-28 |
| 6790768 | Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects | Yongsik Moon, David H. Mai, Kapila Wijekoon, Rajeev Bajaj, Rahul Surana +6 more | 2004-09-14 |
| 6783432 | Additives for pressure sensitive polishing compositions | Jui-Lung Li, Yuchun Wang, Rajeev Bajaj | 2004-08-31 |
| 6780773 | Method of chemical mechanical polishing with high throughput and low dishing | Shijian Li, Jui-Lung Li, Shi-Ping Wang, Gary Lam, David H. Mai | 2004-08-24 |
| 6739951 | Method and apparatus for electrochemical-mechanical planarization | Lizhong Sun, Stan Tsai | 2004-05-25 |
| 6676497 | Vibration damping in a chemical mechanical polishing system | Hung Chih Chen, John M. White, Shijian Li, Ramin Emami | 2004-01-13 |
| 6669538 | Pad cleaning for a CMP system | Shijian Li, Ramin Emami, Sen-Hou Ko, Shi-Ping Wang, Lizhong Sun +1 more | 2003-12-30 |
| 6659849 | Platen with debris control for chemical mechanical planarization | Shijian Li, Jayakumar Gurusamy, Manoocher Birang | 2003-12-09 |
| 6656842 | Barrier layer buffing after Cu CMP | Shijian Li, Ramin Emami, Sen-Hou Ko, John M. White | 2003-12-02 |
| 6645061 | Polishing pad having a grooved pattern for use in chemical mechanical polishing | Doyle E. Bennett, Thomas H. Osterheld, Ginetto Addiego | 2003-11-11 |
| 6638143 | Ion exchange materials for chemical mechanical polishing | Yuchun Wang, Stan Tsai, Kapila Wijekoon, Rajeev Bajaj | 2003-10-28 |
| 6632124 | Optical monitoring in a two-step chemical mechanical polishing process | Bret W. Adams, Boguslaw A. Swedek, Rajeev Bajaj, Savitha Nanjangud, Andreas Norbert Wiswesser +3 more | 2003-10-14 |
| 6629881 | Method and apparatus for controlling slurry delivery during polishing | Rajeev Bajaj, Frank Bose, A. Jason Whitby | 2003-10-07 |
| 6620027 | Method and apparatus for hard pad polishing | Ajoy Zutshi, Rajeev Bajaj, Yutao Ma, Kapila Wijekoon | 2003-09-16 |
| 6602724 | Chemical mechanical polishing of a metal layer with polishing rate monitoring | Rajeev Bajaj | 2003-08-05 |
| 6592438 | CMP platen with patterned surface | Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney P. Huey | 2003-07-15 |
| 6589610 | Deposition chamber and method for depositing low dielectric constant films | Shijian Li, Yaxin Wang, Tetsuya Ishikawa, Alan W. Collins | 2003-07-08 |
| 6585563 | In-situ monitoring of linear substrate polishing operations | Manoocher Birang, Shijian Li, Sasson Somekh | 2003-07-01 |