Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7547243 | Method of making and apparatus having polishing pad with window | Ramiel Oshana, Kerry F. Hughes, Jay Rohde, David Datong Huo, Dominic J. Benvegnu | 2009-06-16 |
| 7264536 | Polishing pad with window | Ramiel Oshana, Kerry F. Hughes, Jay Rohde, David Datong Huo, Dominic J. Benvegnu | 2007-09-04 |
| 7198544 | Polishing pad with window | — | 2007-04-03 |
| 7101254 | System and method for in-line metal profile measurement | Boguslaw A. Swedek, Nils Johansson, Manoocher Birang | 2006-09-05 |
| 7086929 | Endpoint detection with multiple light beams | Walter Schoenleber | 2006-08-08 |
| 7018271 | Method for monitoring a substrate during chemical mechanical polishing | Walter Schoenleber, Boguslaw A. Swedek | 2006-03-28 |
| 7008295 | Substrate monitoring during chemical mechanical polishing | Manoocher Birang, Boguslaw A. Swedek | 2006-03-07 |
| 6994607 | Polishing pad with window | — | 2006-02-07 |
| 6986699 | Method and apparatus for determining polishing endpoint with multiple light sources | Walter Schoenleber, Boguslaw A. Swedek, Manoocher Birang | 2006-01-17 |
| 6913511 | Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers | Judon Tony Pan, Boguslaw A. Swedek | 2005-07-05 |
| 6832950 | Polishing pad with window | Jason Wright, Boguslaw A. Swedek | 2004-12-21 |
| 6811466 | System and method for in-line metal profile measurement | Boguslaw A. Swedek, Nils Johansson, Manoocher Birang | 2004-11-02 |
| 6764380 | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing | Walter Schoenleber, Boguslaw A. Swedek | 2004-07-20 |
| 6716085 | Polishing pad with transparent window | Boguslaw A. Swedek | 2004-04-06 |
| 6659842 | Method and apparatus for optical monitoring in chemical mechanical polishing | Judon Tony Pan, Buguslaw Swedek, Manoocher Birang | 2003-12-09 |
| 6652355 | Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers | Judon Tony Pan, Boguslaw A. Swedek | 2003-11-25 |
| 6632124 | Optical monitoring in a two-step chemical mechanical polishing process | Bret W. Adams, Boguslaw A. Swedek, Rajeev Bajaj, Savitha Nanjangud, Stan Tsai +3 more | 2003-10-14 |
| 6607422 | Endpoint detection with light beams of different wavelengths | Boguslaw A. Swedek | 2003-08-19 |
| 6524165 | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing | Walter Schoenleber, Boguslaw A. Swedek | 2003-02-25 |
| 6506097 | Optical monitoring in a two-step chemical mechanical polishing process | Bret W. Adams, Boguslaw A. Swedek, Rajeev Bajaj, Savitha Nanjangud, Stan Tsai +3 more | 2003-01-14 |
| 6494766 | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing | Wallter Waiter Schoenleber, Boguslaw A. Swedek | 2002-12-17 |
| 6296548 | Method and apparatus for optical monitoring in chemical mechanical polishing | Judon Tony Pan, Boguslaw A. Swedek, Manoocher Birang | 2001-10-02 |
| 6280289 | Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers | Judon Tony Pan, Boguslaw A. Swedek | 2001-08-28 |
| 6247998 | Method and apparatus for determining substrate layer thickness during chemical mechanical polishing | Walter Schoenleber, Boguslaw A. Swedek, Manoocher Birang | 2001-06-19 |
| 6190234 | Endpoint detection with light beams of different wavelengths | Boguslaw A. Swedek | 2001-02-20 |