| 7086929 |
Endpoint detection with multiple light beams |
Andreas Norbert Wiswesser |
2006-08-08 |
| 7018271 |
Method for monitoring a substrate during chemical mechanical polishing |
Andreas Norbert Wiswesser, Boguslaw A. Swedek |
2006-03-28 |
| 6986699 |
Method and apparatus for determining polishing endpoint with multiple light sources |
Andreas Norbert Wiswesser, Boguslaw A. Swedek, Manoocher Birang |
2006-01-17 |
| 6764380 |
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
Andreas Norbert Wiswesser, Boguslaw A. Swedek |
2004-07-20 |
| 6524165 |
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
Andreas Norbert Wiswesser, Boguslaw A. Swedek |
2003-02-25 |
| 6247998 |
Method and apparatus for determining substrate layer thickness during chemical mechanical polishing |
Andreas Norbert Wiswesser, Boguslaw A. Swedek, Manoocher Birang |
2001-06-19 |
| 6221784 |
Method and apparatus for sequentially etching a wafer using anisotropic and isotropic etching |
Ursula Ingeborg Schmidt, Michael J. Schmidt |
2001-04-24 |
| 6159073 |
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
Andreas Norbert Wiswesser, Boguslaw A. Swedek |
2000-12-12 |
