Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7086929 | Endpoint detection with multiple light beams | Andreas Norbert Wiswesser | 2006-08-08 |
| 7018271 | Method for monitoring a substrate during chemical mechanical polishing | Andreas Norbert Wiswesser, Boguslaw A. Swedek | 2006-03-28 |
| 6986699 | Method and apparatus for determining polishing endpoint with multiple light sources | Andreas Norbert Wiswesser, Boguslaw A. Swedek, Manoocher Birang | 2006-01-17 |
| 6764380 | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing | Andreas Norbert Wiswesser, Boguslaw A. Swedek | 2004-07-20 |
| 6524165 | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing | Andreas Norbert Wiswesser, Boguslaw A. Swedek | 2003-02-25 |
| 6247998 | Method and apparatus for determining substrate layer thickness during chemical mechanical polishing | Andreas Norbert Wiswesser, Boguslaw A. Swedek, Manoocher Birang | 2001-06-19 |
| 6221784 | Method and apparatus for sequentially etching a wafer using anisotropic and isotropic etching | Ursula Ingeborg Schmidt, Michael J. Schmidt | 2001-04-24 |
| 6159073 | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing | Andreas Norbert Wiswesser, Boguslaw A. Swedek | 2000-12-12 |