Issued Patents All Time
Showing 76–100 of 169 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7231682 | Method and apparatus for simultaneously cleaning the front side and back side of a wafer | John M. Boyd, Katrina Mikhaylich | 2007-06-19 |
| 7220322 | Cu CMP polishing pad cleaning | Lizhong Sun, Shijian Li | 2007-05-22 |
| 7201636 | Chemical mechanical polishing a substrate having a filler layer and a stop layer | Raymond R. Jin, Shijian Li, Thomas H. Osterheld | 2007-04-10 |
| 7191787 | Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid | John M. Boyd, John Parks | 2007-03-20 |
| 7153400 | Apparatus and method for depositing and planarizing thin films of semiconductor wafers | Mike Ravkin, John M. Boyd, Yezdi Dordi, John M. de Larios | 2006-12-26 |
| 7153188 | Temperature control in a chemical mechanical polishing system | Steven M. Zuniga, Hung Chih Chen, Stan Tsai, Kapila Wijekoon, Rajeev Bajaj | 2006-12-26 |
| 7143527 | System and method for modulating flow through multiple ports in a proximity head | James P. Garcia, John M. de Larios | 2006-12-05 |
| 7127831 | Methods and systems for processing a substrate using a dynamic liquid meniscus | James P. Garcia, John M. de Larios, Michael Ravkin, Carl Woods | 2006-10-31 |
| 7108591 | Compliant wafer chuck | John M. Boyd, Yezdi Dordi | 2006-09-19 |
| 7104267 | Planarized copper cleaning for reduced defects | Ramin Emami, Shijian Li, Sen-Hou Ko, Madhavi R. Chandrachood | 2006-09-12 |
| 7090562 | Methods of and apparatus for pre-planarizing a substrate | John M. Boyd, Yezdi Dordi | 2006-08-15 |
| 7069937 | Vertical proximity processor | James P. Garcia, Mike Ravkin, Carl Woods, John M. de Larios | 2006-07-04 |
| 7048608 | Semiconductor wafer material removal apparatus and method for operating the same | John M. Boyd, Yezdi Dordi | 2006-05-23 |
| 7040330 | Method and apparatus for megasonic cleaning of patterned substrates | John M. Boyd, Michael Ravkin | 2006-05-09 |
| 7040332 | Method and apparatus for megasonic cleaning with reflected acoustic waves | John M. Boyd, Randolph Treur, William Thie | 2006-05-09 |
| 7041599 | High through-put Cu CMP with significantly reduced erosion and dishing | Shijian Li, John M. White, Ramin Emami | 2006-05-09 |
| 7014545 | Vibration damping in a chemical mechanical polishing system | Hung Chih Chen, John M. White, Shijian Li, Ramin Emami | 2006-03-21 |
| 7003899 | System and method for modulating flow through multiple ports in a proximity head | James P. Garcia, John M. de Larios | 2006-02-28 |
| 6991517 | Linear polishing sheet with window | Manoocher Birang, Shijian Li, Sasson Somekh | 2006-01-31 |
| 6988327 | Methods and systems for processing a substrate using a dynamic liquid meniscus | James P. Garcia, John M. de Larios, Michael Ravkin, Carl Woods | 2006-01-24 |
| 6960521 | Method and apparatus for polishing metal and dielectric substrates | Yongsik Moon, David H. Mai, Kapila Wijekoon, Rajeev Bajaj, Rahul Surana +6 more | 2005-11-01 |
| 6921494 | Backside etching in a scrubber | Brian J. Brown, Madhavi R. Chandrachood, Radha Nayak, Michael Sugarman, John M. White | 2005-07-26 |
| 6872329 | Chemical mechanical polishing composition and process | Yuchun Wang, Rajeev Bajaj, Shijian Li | 2005-03-29 |
| 6869332 | Chemical mechanical polishing of a metal layer with polishing rate monitoring | Rajeev Bajaj | 2005-03-22 |
| 6864181 | Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition | John M. Boyd | 2005-03-08 |