Issued Patents All Time
Showing 51–75 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7615482 | Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength | Daniel C. Edelstein, Stephen M. Gates, Alfred Grill, Steven E. Molis, Vu Ngoc Tran Nguyen +3 more | 2009-11-10 |
| 7611996 | Multi-stage curing of low K nano-porous films | Francimar Schmitt, Yi Zheng, Kang Sub Yim, Sang-Hoon Ahn, Lester D'Cruz +4 more | 2009-11-03 |
| 7588803 | Multi step ebeam process for modifying dielectric materials | Li-Qun Xia, Tzu-Fang Huang, Wen Zhu | 2009-09-15 |
| 7547643 | Techniques promoting adhesion of porous low K film to underlying barrier layer | Francimar Schmitt, Derek R. Witty, Hichem M'Sadd, Sang-Hoon Ahn, Lester D'Cruz +2 more | 2009-06-16 |
| 7425716 | Method and apparatus for reducing charge density on a dielectric coated substrate after exposure to a large area electron beam | Khaled A. Elsheref, Yuri Trachuk, Tom K. Cho, Girish Dixit, Hichem M'Saad +1 more | 2008-09-16 |
| 7410916 | Method of improving initiation layer for low-k dielectric film by digital liquid flow meter | Dustin W. Ho, Juan Carlos Rocha-Alvarez, Kelvin Chan, Nagarajan Rajagopalan, Visweswaren Sivaramakrishnan | 2008-08-12 |
| 7323399 | Clean process for an electron beam source | Khaled A. Elsheref, Josphine J. Chang, Hichem M'Saad | 2008-01-29 |
| 7297376 | Method to reduce gas-phase reactions in a PECVD process with silicon and organic precursors to deposit defect-free initial layers | Kang Sub Yim, Kelvin Chan, Nagarajan Rajagopalan, Josephine Ju-Hwei Chang Liu, Sang-Hoon Ahn +3 more | 2007-11-20 |
| 7265062 | Ionic additives for extreme low dielectric constant chemical formulations | Robert P. Mandal, Timothy Weidman, Michael P. Nault, Nikolaos Bekiaris, Scott J. Weigel +3 more | 2007-09-04 |
| 7259381 | Methodology for determining electron beam penetration depth | Josephine Ju-Hwei Chang Liu, Hichem M'Saad | 2007-08-21 |
| 7256139 | Methods and apparatus for e-beam treatment used to fabricate integrated circuit devices | Farhad Moghadam, Jun Zhao, Timothy Weidman, Rick J. Roberts, Li Xia | 2007-08-14 |
| 7049606 | Electron beam treatment apparatus | Hari Ponnekanti, Jun Zhao, Helen R. Armer | 2006-05-23 |
| 7045798 | Characterizing an electron beam treatment apparatus | Khaled A. Elsheref, Hichem M'Saad | 2006-05-16 |
| 7036453 | Apparatus for reducing plasma charge damage for plasma processes | Tetsuya Ishikawa, Seon-Mee Cho, Feng Gao, Kaveh Niazi, Michio Aruga | 2006-05-02 |
| 7018941 | Post treatment of low k dielectric films | Zhenjiang Cui, Josephine Chang, Reza Arghavani, Derek R. Witty, Helen R. Armer +2 more | 2006-03-28 |
| 6936551 | Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices | Farhad Moghadam, Jun Zhao, Timothy Weidman, Rick J. Roberts, Li-Qun Xia | 2005-08-30 |
| 6896955 | Ionic additives for extreme low dielectric constant chemical formulations | Robert P. Mandal, Timothy Weidman, Michael P. Nault, Nikolaos Bekiaris, Scott J. Weigel +3 more | 2005-05-24 |
| 6890403 | Apparatus and process for controlling the temperature of a substrate in a plasma reactor | Jeff S. Cheung | 2005-05-10 |
| 6878644 | Multistep cure technique for spin-on-glass films | Zhenjiang Cui, Rick J. Roberts, Michael S. Cox, Jun Zhao, Khaled A. Elsheref | 2005-04-12 |
| 6831284 | Large area source for uniform electron beam generation | Hari Ponnekanti, Jun Zhao, Helen R. Armer, William R. Livesay, Scott C. Woods | 2004-12-14 |
| 6818289 | Mesoporous films having reduced dielectric constants | James Edward MacDougall, Kevin Ray Heier, Scott J. Weigel, Timothy Weidman, Nikolaos Bekiaris +3 more | 2004-11-16 |
| 6660662 | Method of reducing plasma charge damage for plasma processes | Tetsuya Ishikawa, Seon-Mee Cho, Feng Gao, Kaveh Niazi, Michio Aruga | 2003-12-09 |
| 6592980 | Mesoporous films having reduced dielectric constants | James Edward MacDougall, Kevin Ray Heier, Scott J. Weigel, Timothy Weidman, Nikolaos Bekiaris +3 more | 2003-07-15 |
| 6576568 | Ionic additives for extreme low dielectric constant chemical formulations | Robert P. Mandal, Timothy Weidman, Michael P. Nault, Nikolaos Bekiaris, Scott J. Weigel +3 more | 2003-06-10 |
| 6461980 | Apparatus and process for controlling the temperature of a substrate in a plasma reactor chamber | Jeff S. Cheung | 2002-10-08 |