Issued Patents All Time
Showing 51–75 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7067902 | Building metal pillars in a chip for structure support | Habib Hichri, Xiao Hu Liu, Conal E. Murray, Jawahar P. Nayak, Thomas M. Shaw | 2006-06-27 |
| 6989282 | Control of liner thickness for improving thermal cycle reliability | Ronald G. Filippi, Lynne M. Gignac, Conal E. Murray, Hazara S. Rathore, Thomas M. Shaw +1 more | 2006-01-24 |
| 6982227 | Single and multilevel rework | Edward C. Cooney, III, Robert M. Geffken, William T. Motsiff, Mark P. Murray, Amanda Piper +4 more | 2006-01-03 |
| 6972209 | Stacked via-stud with improved reliability in copper metallurgy | Birendra Agarwala, Conrad A. Barile, Hormazdyar M. Dalal, Brett H. Engle, Michael Lane +8 more | 2005-12-06 |
| 6939797 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane +3 more | 2005-09-06 |
| 6914320 | Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof | Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Terence L. Kane, Naftall E. Lustig +5 more | 2005-07-05 |
| 6887783 | Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof | Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Terence L. Kane, Naftall E. Lustig +5 more | 2005-05-03 |
| 6831363 | Structure and method for reducing thermo-mechanical stress in stacked vias | Timothy J. Dalton, Sanjit Das, Brett H. Engel, Brian Herbst, Habib Hichri +8 more | 2004-12-14 |
| 6821890 | Method for improving adhesion to copper | Thomas Ivers, Joyce C. Liu, Henry A. Nye, III | 2004-11-23 |
| 6737747 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane +3 more | 2004-05-18 |
| 6727589 | Dual damascene flowable oxide insulation structure and metallic barrier | Stephen E. Greco, John P. Hummel, Joyce C. Liu, Rebecca D. Mih, Kamalesh K. Srivastava | 2004-04-27 |
| 6674168 | Single and multilevel rework | Edward C. Cooney, III, Robert M. Geffken, William T. Motsiff, Mark P. Murray, Amanda Piper +4 more | 2004-01-06 |
| 6559046 | Insulator for integrated circuits and process | Stephan A. Cohen, Ronald R. Uttecht | 2003-05-06 |
| 6486557 | Hybrid dielectric structure for improving the stiffness of back end of the line structures | Charles R. Davis, Daniel C. Edelstein, John C. Hay, Jr., Jeffrey Hedrick, Christopher V. Jahnes +1 more | 2002-11-26 |
| 6479884 | Interim oxidation of silsesquioxane dielectric for dual damascene process | Robert Cook, Stephen E. Greco, John P. Hummel, Joyce C. Liu, Rebecca D. Mih +1 more | 2002-11-12 |
| 6478212 | Bond pad structure and method for reduced downward force wirebonding | Brett H. Engel, Henry A. Nye, III | 2002-11-12 |
| 6387754 | Method of forming an on-chip decoupling capacitor with bottom hardmask | Timothy J. Dalton, Andrew P. Cowley, Peter A. Emmi, Erdem Kaltalioglu | 2002-05-14 |
| 6348736 | In situ formation of protective layer on silsesquioxane dielectric for dual damascene process | John P. Hummel, Joyce C. Liu, Rebecca D. Mih, Kamalesh K. Srivastava, Robert Cook +1 more | 2002-02-19 |
| 6331481 | Damascene etchback for low .epsilon. dielectric | Anthony K. Stamper | 2001-12-18 |
| 6329280 | Interim oxidation of silsesquioxane dielectric for dual damascene process | Robert Cook, Stephen E. Greco, John P. Hummel, Joyce C. Liu, Rebecca D. Mih +1 more | 2001-12-11 |
| 6278147 | On-chip decoupling capacitor with bottom hardmask | Timothy J. Dalton, Andrew P. Cowley, Peter A. Emmi, Erdem Kaltalioglu | 2001-08-21 |
| 6271595 | Method for improving adhesion to copper | Thomas Ivers, Joyce C. Liu, Henry A. Nye, III | 2001-08-07 |
| 6261945 | Crackstop and oxygen barrier for low-K dielectric integrated circuits | Henry A. Nye, III, Kurt A. Tallman | 2001-07-17 |
| 6221780 | Dual damascene flowable oxide insulation structure and metallic barrier | Stephen E. Greco, John P. Hummel, Joyce C. Liu, Rebecca D. Mih, Kamalesh K. Srivastava | 2001-04-24 |
| 6133136 | Robust interconnect structure | Daniel C. Edelstein, Henry A. Nye, III, Brian George Reid Ottey, William H. Price | 2000-10-17 |