Issued Patents All Time
Showing 26–50 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8232648 | Semiconductor article having a through silicon via and guard ring | Michael J. Shapiro | 2012-07-31 |
| 8129286 | Reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2012-03-06 |
| 8013394 | Integrated circuit having resistor between BEOL interconnect and FEOL structure and related method | Anil K. Chinthakindi | 2011-09-06 |
| 7977032 | Method to create region specific exposure in a layer | Christos D. Dimitrakopoulos, Daniel C. Edelstein, Satyanarayana V. Nitta, Kevin S. Petrarca, Shom Ponoth +1 more | 2011-07-12 |
| 7979151 | Run-time dispatch system for enhanced product characterization capability | — | 2011-07-12 |
| 7972965 | Process for interfacial adhesion in laminate structures through patterned roughing of a surface | Edward C. Cooney, III, Thomas M. Shaw, Anthony K. Stamper, Matthew E. Colburn | 2011-07-05 |
| 7948083 | Reliable BEOL integration process with direct CMP of porous SiCOH dielectric | Christos D. Dimitrakopoulos, Stephen M. Gates, Sanjay C. Mehta | 2011-05-24 |
| 7892940 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2011-02-22 |
| 7592685 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2009-09-22 |
| 7531444 | Method to create air gaps using non-plasma processes to damage ILD materials | Christos D. Dimitrakopoulos, Daniel C. Edelstein, Satyanarayana V. Nittta, Kevin S. Petrarca, Shom Ponoth +1 more | 2009-05-12 |
| 7485582 | Hardmask for improved reliability of silicon based dielectrics | Son V. Nguyen, Michael Lane, Stephen M. Gates, Xiao Hu Liu, Sanjay C. Mehta +1 more | 2009-02-03 |
| 7473636 | Method to improve time dependent dielectric breakdown | Kaushik Chanda, James J. Demarest, Ronald G. Filippi, Roy Iggulden, Edward W. Kiewra +2 more | 2009-01-06 |
| 7456098 | Building metal pillars in a chip for structure support | Habib Hichri, Xiao Hu Liu, Conal E. Murray, Jawahar P. Nayak, Thomas M. Shaw | 2008-11-25 |
| 7439151 | Method and structure for integrating MIM capacitors within dual damascene processing techniques | Douglas D. Coolbaugh, Timothy J. Dalton, Ebenezer E. Eshun, Anthony K. Stamper, Kunal Vaed | 2008-10-21 |
| 7405147 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2008-07-29 |
| 7388224 | Structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Paul S. McLaughlin, Conal E. Murray, Hazara S. Rathore +2 more | 2008-06-17 |
| 7345305 | Control of liner thickness for improving thermal cycle reliability | Ronald G. Filippi, Lynne M. Gignac, Conal E. Murray, Hazara S. Rathore, Thomas M. Shaw +1 more | 2008-03-18 |
| 7335980 | Hardmask for reliability of silicon based dielectrics | Son V. Nguyen, Michael Lane, Stephen M. Gates, Xiao Hu Liu, Sanjay C. Mehta +1 more | 2008-02-26 |
| 7303994 | Process for interfacial adhesion in laminate structures through patterned roughing of a surface | Edward C. Cooney, III, Thomas M. Shaw, Anthony K. Stamper, Matthew E. Colburn | 2007-12-04 |
| 7253105 | Reliable BEOL integration process with direct CMP of porous SiCOH dielectric | Christos D. Dimitrakopoulos, Stephen M. Gates, Sanjay C. Mehta | 2007-08-07 |
| 7253100 | Reducing damage to ulk dielectric during cross-linked polymer removal | Ronald A. DellaGuardia, Daniel C. Edelstein, Habib Hichri | 2007-08-07 |
| 7214608 | Interlevel dielectric layer and metal layer sealing | Matthew S. Angyal, Peter Biolsi, Lawrence A. Clevenger, Habib Hichri, Bernd Kastenmeier +3 more | 2007-05-08 |
| 7109093 | Crackstop with release layer for crack control in semiconductors | John A. Fitzsimmons, Michael Lane, Thomas M. Shaw, Anthony K. Stamper | 2006-09-19 |
| 7098676 | Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor | William Francis Landers, Thomas M. Shaw, Diana Llera-Hurlburt, Scott W. Crowder, Sandra G. Malhotra +3 more | 2006-08-29 |
| 7098054 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Paul S. McLaughlin, Conal E. Murray, Hazara S. Rathore +2 more | 2006-08-29 |