Issued Patents All Time
Showing 51–75 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7115517 | Method of fabricating a dual damascene interconnect structure | Xiaoye Zhao, Hong Du | 2006-10-03 |
| 7094316 | Externally excited torroidal plasma source | Hiroji Hanawa, Kenneth S. Collins, Kartik Ramaswamy, Andrew Nguyen, Tsutomu Tanaka | 2006-08-22 |
| 7030335 | Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression | Daniel J. Hoffman, Gerald Yin, Dan Katz, Douglas A. Buchberger, Jr., Xiaoye Zhao +3 more | 2006-04-18 |
| 6939434 | Externally excited torroidal plasma source with magnetic control of ion distribution | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Andrew Nguyen, Michael Barnes +1 more | 2005-09-06 |
| 6939808 | Undoped and fluorinated amorphous carbon film as pattern mask for metal etch | Eugene Tzou, Jie Yuan | 2005-09-06 |
| 6921727 | Method for modifying dielectric characteristics of dielectric layers | Kang-Lie Chiang, Mahmoud Dahimene, Xiaoye Zhao, Gerardo Delgadino, Hoiman Hung +2 more | 2005-07-26 |
| 6905968 | Process for selectively etching dielectric layers | Chang-Lin Hsieh, Jie Yuan, Hui Chen, Theodoros Panagopoulos | 2005-06-14 |
| 6897154 | Selective etching of low-k dielectrics | Terry Leung, Qiqun Zheng, Chang-Lin Hsieh, Takehiko Komatsu | 2005-05-24 |
| 6894245 | Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression | Daniel J. Hoffman, Dan Katz, Douglas A. Buchberger, Jr., Xiaoye Zhao, Kang-Lie Chiang +2 more | 2005-05-17 |
| 6853141 | Capacitively coupled plasma reactor with magnetic plasma control | Daniel J. Hoffman, Matthew L. Miller, Jang-Gyoo Yang, Heeyeop Chae, Michael Barnes +1 more | 2005-02-08 |
| 6677712 | Gas distribution plate electrode for a plasma receptor | Dan Katz, Douglas A. Buchberger, Jr., Robert B. Hagen, Xiaoye Zhao, Ananda H. Kumar +3 more | 2004-01-13 |
| 6667577 | Plasma reactor with spoke antenna having a VHF mode with the spokes in phase | Steven C. Shannon, Daniel J. Hoffman, Chunshi Cui, Gerardo Delgadino, Douglas A. Buchberger, Jr. +4 more | 2003-12-23 |
| 6652712 | Inductive antenna for a plasma reactor producing reduced fluorine dissociation | Shiang-Bau Wang, Daniel J. Hoffman, Chunshi Cui, Gerardo Delgadino, David Brian McParland +3 more | 2003-11-25 |
| 6623595 | Wavy and roughened dome in plasma processing reactor | Nianci Han, Hong Shih, Li Xu | 2003-09-23 |
| 6620289 | Method and apparatus for asymmetric gas distribution in a semiconductor wafer processing system | Chun Yan, Diana Xiaobing Ma | 2003-09-16 |
| 6607634 | Reticle adapter for a reactive ion etch system | Richard W. Plavidal | 2003-08-19 |
| 6607675 | Method of etching carbon-containing silicon oxide films | Chang-Lin Hsieh, Hui Chen, Jie Yuan | 2003-08-19 |
| 6586886 | Gas distribution plate electrode for a plasma reactor | Dan Katz, Douglas A. Buchberger, Jr., Robert B. Hagen, Xiaoye Zhao, Ananda H. Kumar +3 more | 2003-07-01 |
| 6551446 | Externally excited torroidal plasma source with a gas distribution plate | Hiroji Hanawa, Kenneth S. Collins, Kartik Ramaswamy, Andrew Nguyen, Tsutomu Tanaka | 2003-04-22 |
| 6547977 | Method for etching low k dielectrics | Chun Yan, Gary Hsueh, Diana Xiaobing Ma | 2003-04-15 |
| 6547978 | Method of heating a semiconductor substrate | Allen Zhao, Xiancan Deng, Diana Xiaobing Ma, Chang-Lin Hsieh | 2003-04-15 |
| 6534416 | Control of patterned etching in semiconductor features | Allen Zhao, Xiancan Deng, Diana Xiaobing Ma | 2003-03-18 |
| 6494986 | Externally excited multiple torroidal plasma source | Hiroji Hanawa, Kenneth S. Collins, Kartik Ramaswamy, Andrew Nguyen, Tsutomu Tanaka | 2002-12-17 |
| 6489247 | Copper etch using HCl and HBR chemistry | Allen Zhao, Xiancan Deng, Diana Xiaobing Ma | 2002-12-03 |
| 6488862 | Etched patterned copper features free from etch process residue | Diana Xiaobing Ma, Gerald Yin | 2002-12-03 |