Issued Patents All Time
Showing 26–50 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8012794 | Capping layers for metal oxynitride TFTS | — | 2011-09-06 |
| 7994508 | Thin film transistors using thin film semiconductor materials | — | 2011-08-09 |
| 7988470 | Methods of fabricating metal oxide or metal oxynitride TFTs using wet process for source-drain metal etch | — | 2011-08-02 |
| 7972467 | Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor | Kallol Bera, James D. Carducci, Daniel J. Hoffman, Steven C. Shannon, Douglas A. Buchberger, Jr. | 2011-07-05 |
| 7955986 | Capacitively coupled plasma reactor with magnetic plasma control | Daniel J. Hoffman, Matthew L. Miller, Jang-Gyoo Yang, Heeyeop Chae, Michael Barnes +1 more | 2011-06-07 |
| 7927713 | Thin film semiconductor material produced through reactive sputtering of zinc target using nitrogen gases | — | 2011-04-19 |
| 7879698 | Integrated process system and process sequence for production of thin film transistor arrays using doped or compounded metal oxide semiconductor | — | 2011-02-01 |
| 7768765 | Substrate support having heat transfer system | Andrew Nguyen, Wing Cheng, Hiroji Hanawa, Semyon L. Kats, Kartik Ramaswamy +4 more | 2010-08-03 |
| 7754997 | Apparatus and method to confine plasma and reduce flow resistance in a plasma | Kallol Bera, James D. Carducci, Daniel J. Hoffman, Steven C. Shannon, Douglas A. Buchberger, Jr. | 2010-07-13 |
| 7674662 | Process for making thin film field effect transistors using zinc oxide | John M. White, David Eaglesham | 2010-03-09 |
| 7674353 | Apparatus to confine plasma and to enhance flow conductance | Kallol Bera, Daniel J. Hoffman, Michael Kutney, Douglas A. Buchberger, Jr. | 2010-03-09 |
| 7618516 | Method and apparatus to confine plasma and to enhance flow conductance | Kallol Bera, Daniel J. Hoffman, Michael Kutney, Douglas A. Buchberger, Jr. | 2009-11-17 |
| 7601558 | Transparent zinc oxide electrode having a graded oxygen content | Yanping Li | 2009-10-13 |
| 7588668 | Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers | John M. White | 2009-09-15 |
| 7585384 | Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor | Kallol Bera, James D. Carducci, Daniel J. Hoffman, Steven C. Shannon, Douglas A. Buchberger, Jr. | 2009-09-08 |
| 7435685 | Method of forming a low-K dual damascene interconnect structure | Gerardo Delgadino, Neungho Shin, Yunsang Kim, Li-Qun Xia, Tzu-Fang Huang +6 more | 2008-10-14 |
| 7413990 | Method of fabricating a dual damascene interconnect structure | Xiaoye Zhao, Hong Du | 2008-08-19 |
| 7309448 | Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material | Hee Yeop Chae, Jeremiah T. Pender, Gerardo Delgadino, Xiaoye Zhao | 2007-12-18 |
| 7300597 | Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material | Hee Yeop Chae, Jeremiah T. Pender, Gerardo Delgadino, Xiaoye Zhao | 2007-11-27 |
| 7256134 | Selective etching of carbon-doped low-k dielectrics | Yunsang Kim, Neungho Shin, Heeyeop Chae, Joey Chiu, Fang Tian +1 more | 2007-08-14 |
| 7221553 | Substrate support having heat transfer system | Andrew Nguyen, Wing Cheng, Hiroji Hanawa, Semyon L. Kats, Kartik Ramaswamy +4 more | 2007-05-22 |
| 7220937 | Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination | Daniel Hofman, Jennifer Y. Sun, Senh Thach | 2007-05-22 |
| 7186943 | MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression | Daniel J. Hoffman, Dan Katz, Douglas A. Buchberger, Jr., Xiaoye Zhao, Kang-Lie Chiang +2 more | 2007-03-06 |
| 7132369 | Method of forming a low-K dual damascene interconnect structure | Gerardo Delgadino, Neungho Shin, Yunsang Kim, Li-Qun Xia, Tzu-Fang Huang +6 more | 2006-11-07 |
| 7132618 | MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression | Daniel J. Hoffman, Dan Katz, Douglas A. Buchberger, Jr., Xiaoye Zhao, Kang-Lie Chiang +2 more | 2006-11-07 |